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Wednesday 29 May 2024
TechInsights: Semiconductor production capacity in China to grow by 40% in next five years
Key Takeaway: Fabs located in China have been purchasing equipment at a rapid pace during the past three years leading to expanding capacity.
Wednesday 29 May 2024
China Big Fund kicks off 3rd phase capital support for local chip industry
China's freshly launched CNY344 billion (US$47.5 billion) national chip fund is likely to prioritize investments in major semiconductor firms, supporting their development of AI computing...
Tuesday 28 May 2024
China chipmakers catching up fast in AI, SenseTime's Xu says
China's domestic AI chipmakers are making fast progress in closing the gap on international leaders, according to SenseTime Group Inc. co-founder Xu Bing.
Tuesday 28 May 2024
Samsung eyes rolling out 1,000-layer 3D NAND by 2030 with new material
Samsung Electronics is keenly exploring "hafnia ferroelectrics" as a next-generation NAND flash material, with the hope that this new material will enable stacking over 1,000 layers...
Tuesday 28 May 2024
Samsung reportedly achieves technical breakthrough, stacking 3D DRAM to 16 layers
Samsung Electronics has successfully stacked the next-gen 3D DRAM to 16 layers, twice as many as its competitor Micron.
Tuesday 28 May 2024
Former SK Hynix employee arrested on allegations of leaking memory technology to Huawei
South Korean media outlets Money Today and Yonhap News reported that the Industrial Technology Security Investigation Team of the South Gyeonggi Provincial Police...
Tuesday 28 May 2024
Micron reportedly plans to produce advanced DRAM in Japan by the end of 2027
Micron, which has a DRAM factory in Hiroshima Prefecture, Japan, is reportedly planning to construct a new plant adjacent to the existing Hiroshima factory as early as 2026.
Tuesday 28 May 2024
China can break through US EUV ban with mature-node innovation, but how?
China's Huawei claims to have successfully achieved domestic substitution of using its self-developed 7nm and 5nm chips in its smartphones and has boosted market standings of HiSilicon...
Monday 27 May 2024
China creates US$47.5 billion chip fund to back nation's firms
China has set up the country's largest-ever semiconductor investment fund to propel the development of the domestic chip industry, the latest effort from Beijing to achieve self-sufficiency...
Monday 27 May 2024
South Korean media analyze why Samsung's HBM fails to pass Nvidia certification test
Samsung Electronic's HBM3E failed to pass Nvidia's verification tests due to heating and power consumption concerns. Although Samsung declined to comment on specific customers, the...
Monday 27 May 2024
Are TSMC and SK Hynix on the same page regarding HBM4 collaboration?
SK Hynix and TSMC are collaborating on the development of the next generation of high bandwidth memory (HBM). Although it is widely believed that SK Hynix would entrust TSMC with...
Monday 27 May 2024
South Korea looks to bolster IC design sector, currently 1% of global market
South Korea has unveiled a support package to strengthen its semiconductor industry and catch up with international rivals. The plan aims to support large companies and weaker sectors,...
Monday 27 May 2024
Taiwan fab tool makers see demands rising in US and Europe
Onshoring efforts of semiconductor manufacturers have spurred the demand for more cost-effective fab tools. Fab machinery makers in Taiwan, including the supply chain partners of...
Monday 27 May 2024
SK Hynix contract liabilities jump 73% in 1Q24, likely fueled by Nvidia's massive prepayments
SK Hynix's contract liabilities saw a remarkable sequential increase of over 73% or KRW1.16 trillion (US$855 million) in the first quarter of 2024, sparking speculations that Nvidia...
Friday 24 May 2024
Biden moves to secure Chips Act funding for Kenya's Ruto
The US is proposing to make Kenya the first country in Africa to benefit from funding in the Chips and Science Act, according to White House officials, underscoring the countries'...