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Tuesday 21 April 2026
UALink 2.0 strengthens AI interconnect standards but lags behind NVLink in deployment
The UALink Consortium has released version 2.0 of its universal interconnect standard, building on the initial 1.0 launch in April 2025 with enhanced AI accelerator communication and...
Tuesday 21 April 2026
Analysis: Amazon's 11-year chip journey crowns Anthropic and OpenAI as top Trainium customers
Amazon CEO Andy Jassy declared in his latest shareholder letter that the company's self-developed chip business is booming, surpassing US$15 billion in annualized AI revenue through...
Tuesday 21 April 2026
Samsung's HBM4 yield improves, 4nm PMBIST upgrade receives praise from Nvidia
Samsung Electronics is accelerating its catch-up in the high-bandwidth memory (HBM) market against leader SK Hynix by advancing its sixth-generation HBM4. A key factor is Samsung's...
Monday 20 April 2026
Potential Google-Marvell partnership escalates AI chip competition against Nvidia
Google is accelerating efforts to strengthen its position in AI silicon through a potential partnership with Marvell Technology. It is making a move that highlights the competitive...
Friday 17 April 2026
OpenAI's HBM push signals a new AI memory arms race
A recent report by South Korea's Chosun Biz highlights how OpenAI is actively building a dedicated supply line with Samsung Electronics to secure high-bandwidth memory (HBM)...
Friday 17 April 2026
OpenAI reportedly to spend over US$20 billion on Cerebras chips, reducing reliance on Nvidia

OpenAI has reportedly entered into a multi-year agreement to pay chip startup Cerebras Systems more than US$20 billion for AI server capacity,...

Friday 17 April 2026
Nio cuts Nvidia reliance with in-house chips, targets lower EV costs

Rising cost pressure is pushing China's smart EV makers to pivot from scale expansion to efficiency and cost discipline.

Thursday 16 April 2026
TSMC hints at next-gen LPU bid, stokes speculation that Samsung's Groq order may not last
TSMC Chairman C.C. Wei disclosed at the company's first-quarter 2026 earnings call that the foundry is collaborating with a customer on next-generation LPU development —a remark...
Thursday 16 April 2026
Cadence, Nvidia deepen AI partnership to reshape chip design and robotics
Cadence Design Systems and Nvidia have expanded their partnership to accelerate the use of artificial intelligence (AI) across semiconductor design, robotics, and large-scale AI infrastructure,...
Thursday 16 April 2026
Analysis: Nvidia links RISC-V to NVLink with SiFive investment

Agentic AI is pulling CPUs back to the center of the AI stack, turning them into a renewed battleground for chipmakers. After Arm moved...

Thursday 16 April 2026
Samsung targets May HBM4E samples for Nvidia after validation

Samsung Electronics is aiming to produce its first samples of next-generation high-bandwidth memory (HBM4E) as early as May, with plans...

Wednesday 15 April 2026
Taiwan equipment makers ride advanced packaging and SiPh wave
Nvidia is accelerating the commercial rollout of silicon photonics (SiPh) technology, marked by the launch of its Rubin Ultra platform and the gradual establishment of co-packaged...
Wednesday 15 April 2026
Nscale redirects OpenAI's Stargate Norway capacity to Microsoft
Hyperscaler Nscale has agreed to rent data center capacity to Microsoft at its campus in Narvik, Norway. Located in the Arctic Circle, the site was previously intended for OpenAI as...
Wednesday 15 April 2026
RISC-V gains ground in AI data centers with Nvidia backing SiFive

AI workloads are scaling faster than traditional CPU architectures were ever designed to handle, exposing clear limits in performance...

Wednesday 15 April 2026
SK Hynix may cut Nvidia HBM4 shipments as Rubin ramp reportedly faces delays

SK Hynix is reportedly considering reducing its planned 2026 shipments of high-bandwidth memory (HBM4) to Nvidia by about 20-30%, amid...