New AI models arrive every few weeks, and the question of which is better often comes down to the leaderboard. Behind those rankings, evaluation can look like an academic exercise...
Advanced Micro Devices (AMD) has agreed to acquire World Labs in an all-stock transaction valued at approximately US$8.2 billion. Following the closing, World Labs will operate as...
Nvidia's new AI agent security platform puts hardware at the centre of agent control, but it also forces enterprises to weigh stronger protection against higher infrastructure costs...
TSMC said the next phase of AI performance growth will depend less on shrinking a single chip and more on combining multiple chips, memory, and advanced packaging inside larger systems...
DIGITIMES Intelligence observes that AI applications are moving through a clear progression: from early classification AI focused on feature recognition, to generative AI capable of...
South Korea's leading telecommunications operator, SK Telecom (SKT), recently established SK Hyper and SK Horizon in quick succession. The moves mark a pivotal shift for telecommunications...
Xunfei Healthcare (iFLYTEK Medical), the healthcare AI arm of China's iFlytek, is using its Spark Medical Large Model to support diagnosis and medical record generation while tackling...
As HBM approaches half the cost of a GPU-HBM CoWoS package, can memory still be viewed as merely a passive component of AI computing? The answer goes back to the "memory wall," a challenge...
Garmin's decision to offer OLED options but no Micro LED version in its new flagship smartwatches, the fenix 9 and fenix 9 Pro, has revived debate over whether the emerging display...
Micron unveiled the Micron Ventures Paradigm Fund, a US$250 million venture vehicle, in mid-August 2026, as the memory maker pairs more than US$25 billion in fiscal 2026 capex with...
Artificial intelligence is rapidly entering enterprise operations, blurring the lines between cybersecurity and supply chain management. In the AI era, Zero Trust is no longer only...
As chip design enters the AI era, heterogeneous integration is driving foundry giants like TSMC, Samsung, and Intel to bring advanced front-end fab capabilities into back-end packaging...
In a recent interview on the DIGITIMES podcast, Dr. Shin-Puu Jeng, chairman of the International Microelectronics and Packaging Society (IMAPS) and a former longtime TSMC...
