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NEWS TAGGED PACKAGING AND TESTING
Thursday 12 October 2023
Backend firms upbeat about demand for new PS5
Backend companies are positive about demand for Sony's new slimmed-down PlayStation 5 (PS5), which will hit the shelves in mid-November, according to industry sources.
Tuesday 26 September 2023
Miniaturization trend for Wi-Fi modules remains unchanged; packaging testing suppliers rely on SiP
Taiwanese OSAT providers stated that the trend of connectivity in everything will continue in 2024, and it will be combined with trends such as cloud AI, edge computing, and high-speed...
Tuesday 26 September 2023
OSATs gearing up for heterogeneous integration boom in 2024
OSATs are bracing for a surge in demand for heterogeneous integration, which will necessitate CoWoS, silicon photonics (SiPh), and other new technologies in 2024, according to industry...
Friday 28 July 2023
Backend houses to see seasonal demand pick up from Apple supply chain in 3Q23
Semiconductor backend houses, such as leading OSAT ASE Technology Holdings (ASEH) and test interface specialist Chunghwa Precision Test Tech (CHPT), are expected to see sales growth...
Wednesday 5 July 2023
Malaysia emerges as key IC backend production hub
Many OSATs and IDMs have backend production capacities in Penang, Malaysia, which has become an important location for their site expansions.
Tuesday 4 July 2023
Robust advanced chip demand to boost Taiwan supply chain, says ASEH
Taiwan's industry supply chain remains competitive in the advanced chip market, which is expected to be undersupplied over the next three to five years, according to Tien Wu, COO...
Thursday 29 June 2023
IC backend industry supply chains in Eastern Europe, Southeast Asia expanding
As semiconductor firms such as IDM Intel and OSAT ASE Technology increase their local investments, packaging and testing supply chains are expanding in Eastern Europe and Southeast...
Friday 16 June 2023
Micron to acquire Powertech's Xi'an factory and commit to investments in China
Powertech Technology Inc., one of the world's largest memory packaging and testing service providers, announced on June 16 that it has been informed by Micron Technology of the latter's...
Wednesday 3 May 2023
OSATs remain cautious about handset IC demand
OSATs remain cautious about handset IC demand despite the emergence of short lead-time orders, according to industry sources.
Thursday 27 April 2023
Customers remain hesitant about more advanced processes; academia needs to solve cost and yield rate issues
Although TSMC's 3nm process has already achieved mass production, its capacity utilization rate is not yet filled. Chen Liang-chia, a distinguished professor of the mechanical engineering...