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NEWS TAGGED PACKAGING AND TESTING
Thursday 28 March 2024
IC packaging materials distributor Niching sees brisk order visibility
Niching Industrial has observed clear order visibility for vapor chambers and silver paste materials.
Monday 25 March 2024
IC packaging and testing suppliers coping with electricity price hike
The Taiwanese government decided to raise electricity prices by an average of about 10% starting in April, with industrial electricity prices up by nearly 14%, the third consecutive...
Friday 22 March 2024
DDI backend firms look to OLED, auto displays for 2024 growth
Display driver IC (DDI) backend houses including ChipMos Technologies and Chipbond Technology are optimistic about the market prospects for OLED and automotive displays.
Thursday 21 March 2024
ASEH acquires land for new factory site in Mexico
Taiwanese OSAT ASE Technology Holding (ASEH) has acquired 37,220 square meters of land in Jalisco, Mexico.
Friday 15 March 2024
IC backend houses see AI fuel next phase of growth
IC backend houses generally believe that the AI boom has kicked off a new growth cycle, with rising demand for advanced packaging set to fuel growth for testing service providers.
Thursday 14 March 2024
OSAT ASEH positive on 2H24 operations propelled by AI
OSAT company ASE Technology Holding (ASEH) expects inventory adjustments at clients to conclude in the first half of 2024, followed by an AI-driven comeback in operations in the second...
Tuesday 12 March 2024
Backend houses upbeat about orders for memory chips
With memory chipmakers ready to scale up output, industry sources indicated that backend houses are optimistic about orders from the memory sector beginning in the second quarter...
Wednesday 6 March 2024
KYEC upbeat about AI, HPC chip demand
According to King Yuan Electronics (KYEC), the IC testing specialist is bullish about the AI and HPC chip market. The company anticipates an increase in testing volume in the second...
Friday 23 February 2024
Backend house ChipMOS upbeat about 2024 memory market growth
The memory market will grow at a faster rate than the display driver IC (DDI) segment in 2024, according to ChipMOS Technologies, a backend house specializing in memory chips and...
Monday 19 February 2024
Backend house Lingsen sells Chinese subsidiary
Taiwan-based Lingsen Precision Industries, which specializes in power management IC, sensor, and memory module backend services, recently announced the sale of its subsidiary Ningbo...
Wednesday 31 January 2024
Backend house PTI gearing up for HBM chip production
Powertech Technology (PTI) will see its high-bandwidth memory (HBM) development project start contributing sales between the fourth quarter of 2024 and the first quarter of 2025,...
Friday 19 January 2024
Backend houses bullish about advanced packaging demand
Long-term prospects are bright for advanced packaging technology, thanks to robust demand for AI and HPC chips, according to sources at backend houses.
Thursday 18 January 2024
IC backend houses expect demand to revive in 2H24
IC backend houses anticipate a resurgence in demand during the latter part of 2024 after a disappointing 2023.
Tuesday 16 January 2024
Semiconductors opportunities in emerging markets
India is bound to be a strategic partner for the United States in terms of demographics, domestic market, software talents, and national strategy.
Tuesday 16 January 2024
Backend firm Micro Silicon upbeat on demand for AI device apps
Micro Silicon Electronics, a power IC backend specialist, is optimistic regarding the long-term demand for AI device applications.
Veeam Software
Summary of Tech Supply Chain News!
Taiwan foundry industry revenues to slip in 1Q24 before rising in 2Q24, says DIGITIMES Research
Research Insight: Intel obtains subsidies but faces challenges
South Korea-based makers lead transparent display as China-based competitors ramp up Inkjet investments, according to DIGITIMES Research