Volkswagen Group and NXP Semiconductors have agreed on a strategic partnership under which NXP's S32K5 microcontrollers (MCUs) are intended to serve as a building block of the carmaker's...
Samsung Electronics' next-generation semiconductor process data was allegedly removed without authorization by a university-industry research partner in South Korea, raising concerns...
Taiwan-based Phison Electronics received two awards at Micron Supplier Day 2026, marking the third consecutive year the company has earned recognition from the US memory chipmaker.
The US Federal Communications Commission (FCC) has approved Amazon Leo’s approximately US$11.57 billion acquisition of Globalstar, giving Amazon access to about 25 MHz of mobile...
FarEasTone Telecommunications signed a cooperation agreement with Direct-to-Device (D2D) satellite communications provider Elveo Mobile on October 27 to expand satellite-to-phone services...
Taiwanese startup Skymizer has formally announced a strategic partnership with Egis Technology to develop Flow (T12), a new-generation AI inference chip. Fabricated on TSMC's 12nm...
US materials giant 3M recently entered into a strategic partnership with Taiwanese optical component manufacturer Genius Electronic Optical (GSEO), with plans to acquire a 4.7% stake...
Infineon Technologies and ASMedia have announced a partnership to speed up the adoption of 20Gbps USB, driven by demand from machine-learning cameras and other physical AI devices...
UMC and AP Memory announced a technology and manufacturing partnership on October 22 to develop next-generation power delivery solutions for AI data centers, combining UMC's deep trench...
Verda and Compal Electronics have expanded their partnership to support Verda's rapidly growing AI infrastructure footprint, combining Verda's AI cloud expertise with Compal's expanding...
Syscom Computer Engineering is expanding its portfolio in edge AI and its broader enablement ecosystem, with the company showcasing its latest products at the 2026 AIoT Taiwan exhibition,...
3M Chairman and CEO Bill Brown outlined the latest progress in the company's expanded beam optics (EBO) technology during its third-quarter earnings call, highlighting a contract manufacturing...
Sony Group will not spin off its semiconductor business, which focuses on image sensors, president and CEO Hiroki Totoki said recently. The group is retaining the unit because its...
Apple announced new and expanded US supplier partnerships on October 20, 2026, including plans to commit up to US$100 million to titanium producer Perryman Company over three years...
Foxconn's planned JPY115 billion (US$726.83 million) investment in Mitsubishi Electric Mobility will create a joint venture to expand their electric-vehicle and autonomous-driving...
