A newly released filing from China's National Intellectual Property Administration (CNIPA) shows Huawei submitted a patent in June 2022 outlining a method to achieve 2nm-class metal...
The US International Trade Commission (ITC) has issued its initial determination in Infineon's Section 337 case against China-based GaN supplier Innoscience. In a telling move that...
Innoscience said at midday on December 3 via the Hong Kong Stock Exchange that it had prevailed in its US patent dispute with Infineon, marking a decisive turn in a long-running GaN...
Murata Manufacturing sued Chinese RF front-end leader Maxscend Microelectronics in a German court over alleged patent infringement involving RF filters, marking an escalation of the...
After three years of legal battles over OLED patents, Samsung Display and Beijing Oriental Electronics (BOE) have settled. According to several South Korean media outlets, including...
Under persistent US export restrictions, Huawei Technologies has doubled down on its vast patent portfolio and heavy R&D spending to reinforce its standing in global communications...
At the 2025 World Internet Conference Wuzhen Summit, the China Internet Development Report 2025 showed that as of the first half of 2025, China accounted for about 40.3% of global...
Taiwanese solar module maker TSEC is aiming to reposition itself amid ongoing geopolitical realignments. In remarks on October 29, 2025, TSEC executive vice president William Liao...
Global sensor leader ams OSRAM and LED powerhouse Nichia have expanded their two-decade intellectual property (IP) partnership through a new cross-license agreement. Signed by ams...
China's development of through glass via (TGV) technology, crucial for advanced semiconductor packaging in AI and high-performance computing chips, encounters significant hurdles,...
China is enhancing its DUV lithography technology amid US export restrictions. Yuliangsheng's 28nm immersion DUV machine is being tested at SMIC, while SMEE has patented a method...
Qualcomm announced a legal victory this week in its patent dispute with Arm. The US District Court for Delaware dismissed Arm's claims against Qualcomm and Nuvia regarding licensing...
Alibaba is steadily building a vertically integrated chip ecosystem that spans cloud computing, AI chip design, and advanced packaging. People's Daily recently revealed a...
TSMC has surpassed Intel in the number of US patent applications for silicon photonics (SiPh), a crucial optoelectronic integration technology essential for artificial intelligence...
