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Wednesday 21 October 2026
PCB material shortages persist as capacity expansion extends beyond 2029
Rapid advances in AI and high-performance computing (HPC) are driving printed circuit boards (PCBs) toward higher layer counts, greater density, and higher-performance materials, triggering...
Wednesday 21 October 2026
Taiwan PCB output set to top NT$1 trillion as VP touts AI opportunity
The 27th Taiwan Printed Circuit Industry International Exhibition (TPCA Show 2026) opened in Nangang on October 20, with Vice President Hsiao Bi-khim calling on the PCB industry to...
Wednesday 21 October 2026
DIGITIMES Insights: AI server PCB upgrades drive explosive demand for advanced backdrilling equipment
DIGITIMES observes that as AI servers and high-speed networking equipment continuously pursue higher data transmission rates, printed circuit boards (PCBs) are being upgraded through...
Wednesday 21 October 2026
Zhen Ding Technology showcases AI infrastructure and terminal PCB lineup
PCB manufacturer Zhen Ding Technology (ZDT) Group is exhibiting at TPCA Show 2026 under the theme "One ZDT, Next AI," highlighting its latest technology and R&D achievements in...
Wednesday 21 October 2026
Advanced PCB drilling faces growing demand from AI and high-speed applications
Topoint Technology is positioning its precision PCB drilling business for rising demand from AI servers, high-performance computing, and high-speed transmission applications. At TPCA...
Wednesday 21 October 2026
AI customers seek 3-year partnerships as Unimicron calls for Taiwan PCB supply chain collab
TPCA Show Taipei 2026, organized by the Taiwan Printed Circuit Association (TPCA), opened on October 20. Unimicron Technology chairman S.C. Chien delivered a keynote at the opening...
Wednesday 21 October 2026
Packaging-to-board integration emerges as key gap as AI reshapes electronics supply chain
Packaging, substrate, printed circuit board (PCB), and assembly makers need closer coordination to meet the demands of AI and high-performance computing (HPC), as package-to-board...
Tuesday 20 October 2026
Unimicron chairman sees substrate sizes reaching 14x current scale by 2030
TPCA Show 2026 officially opened, with Unimicron Chairman Shan-Chieh Chien saying in his opening address that solving the three major challenges facing AI accelerators in high-performance...
Tuesday 20 October 2026
AI server demand lifts Tongtai drilling orders through 2027
Tongtai Machine & Tool said it had order visibility for its printed circuit board (PCB) drilling equipment through the end of 2027 as AI infrastructure demand increased pressure...
Tuesday 20 October 2026
Zhen Ding launches PCB talent development platform with National Central University, partners
Zhen Ding Technology Holding announced that it, Elite Material (EMC), Taliang Technology, and Topoint Technology will jointly invest a total of NT$60 million (approx. US$1.85 million)...
Monday 19 October 2026
MKS' Atotech and ESI to Showcase Advanced PCB Solutions at TPCA 2026

MKS Inc. (NASDAQ: MKS), a global provider of enabling technologies that transform our world, today announced that its strategic brands Atotech, offering process chemicals,...

Friday 16 October 2026
Nvidia unveils PTFE switch board at OCP, names Taiwan partners
Nvidia showcased the latest developments in its MGX server platform ecosystem at the OCP Global Summit 2026, unveiling for the first time a switch board sample using polytetrafluoroethylene...
Wednesday 14 October 2026
Kingboard Laminates raises thin-cloth laminates, prepreg prices 15% in eighth hike of 2026
Kingboard Laminates Holdings (KB Laminates), a leading Chinese manufacturer, announced its eighth price increase of 2026 on October 13, raising prices by 15% for laminates and prepreg...
Tuesday 13 October 2026
AI server tracker: Taiwan's CCL, PCB and IC substrate suppliers see widening growth gap despite AI boom

Taiwan's copper-clad laminate (CCL), printed circuit board (PCB) and IC substrate suppliers are seeing uneven returns from AI infrastructure spending...

Monday 12 October 2026
Weekly news roundup: Musk's Terafab faces reality check; Samsung HBM4E clears quality validation
This week's (October 5 to October 11, 2026) coverage highlights intensifying efforts to build resilient semiconductor and AI hardware supply chains. Elon Musk's Terafab project faces...