Broadcom has begun shipping the industry's first 2nm custom compute SoC built on its 3.5D eXtreme Dimension System in Package (XDSiP) platform...

In an interview with DIGITIMES, Patrick McGee, author of 'Apple in China,' joined DIGITIMES vice president Eric Huang in dissecting the...

To accelerate the expansion of its Snapdragon X series processors in the PC market, Qualcomm has recruited former AMD corporate vice president...

Shihlin Electric is entering 2026 with strong operating momentum, supported by accelerated contract releases under Taipower's grid resilience...

Winbond Electronics is entering a powerful demand cycle, with tight supply conditions across DRAM, NOR flash, and SLC NAND extending beyond...