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Wednesday 11 November 2026
Intel targets agentic AI with GPUs and Xeon
Intel is expanding its CPU and GPU portfolio with the Intel GPU D-series, code-named Crescent Island, and next-generation Xeon processors, code-named Diamond Rapids, targeting large-model...
Wednesday 11 November 2026
Intel expands 18A reach with Wildcat Lake AI PC chips
Intel is expanding its computing platform strategy for agentic AI and enterprise workloads with the Intel Core Series 3 processor, codenamed Wildcat Lake, targeting mainstream consumer...
Wednesday 11 November 2026
Cooling solutions provider AVC starts shipping double-sided cold plates for AI servers
Asia Vital Components (AVC) expects all GPU- and ASIC-based AI servers to adopt liquid cooling by the end of 2027, with customers increasingly turning to double-sided cold plates to...
Thursday 5 November 2026
GlobalFoundries secures nearly US$1 billion in custom chip design wins as it expands into physical AI

GlobalFoundries is gaining traction in custom silicon, processor intellectual property (IP) and physical AI applications, as the chipmaker seeks...

Wednesday 4 November 2026
Onsemi to buy Ferric for US$600M to strengthen AI processor power delivery
Onsemi has agreed to acquire Ferric, Inc., a developer of integrated voltage regulator (IVR) technology, for US$600 million in cash plus up to US$175 million in contingent consideration...
Wednesday 4 November 2026
Intel reportedly targets DDR4 upgrades with Raptor Lake Next
DDR4 memory, once gradually fading from the market, is regaining popularity as tight DRAM supply drives DDR5 prices higher. Following AMD's revival of processors supporting the AM4...
Wednesday 4 November 2026
AMD expands server CPU ambitions as Helios moves its AI business to rack scale
AMD is pursuing a larger role in AI infrastructure by combining its growing server CPU franchise with rack-scale systems, broadening its offering beyond individual processors. The...
Friday 30 October 2026
Intel's AI PCs are selling, but the wider PC recovery is still missing
Intel's growing AI PC sales are coexisting with a shrinking PC market, as memory constraints weaken purchases and computer makers reduce processor inventories. The distinction matters...
Thursday 29 October 2026
Asus sees commercial PC prices rising nearly 10% in 2H26
Asus expects commercial PC prices in Taiwan to rise nearly 10% in the second half of 2026 after surging almost 30% in the first half, as higher memory and processor costs continue...
Wednesday 21 October 2026
Breaking AI's memory wall: former TSMC VP charts a path with HBM, optical links and 3D stacking
AI processor performance continues to improve, but memory bandwidth is growing more slowly, making data supply a major constraint on AI chip performance and energy efficiency. Efforts...
Tuesday 20 October 2026
Alibaba's XuanTie tops 6 billion RISC-V chip shipments, expands into AI servers with C950
Cumulative shipments of chips incorporating Alibaba DAMO Academy's RISC-V processor intellectual property (IP), branded XuanTie, have surpassed 6 billion, marking a milestone for the...
Tuesday 20 October 2026
Google demonstrates magic state cultivation on Willow, cutting errors by about 40-fold
Google Quantum AI said on October 15, 2026, that it has shown "magic state cultivation" working in practice on its Willow processor, reducing errors about 40-fold compared with uncultivated...
Monday 19 October 2026
Samsung targets Exynos 2700 expansion as Huawei advances Kirin chips
Samsung Electronics is developing the Exynos 2700 for broader use across its Galaxy S27 lineup in 2027, while Huawei has moved its next-generation Kirin chips into testing. The competing...
Friday 16 October 2026
China's chip earnings boom masks a widening gap between AI processor demand, fading DRAM, NAND price gains
China's semiconductor and computing hardware companies reported or forecast strong earnings growth in the first nine months of 2026, fueled by AI infrastructure investment, demand...
Wednesday 14 October 2026
Huawei's Kirin 9050 Pro delivers 53.5% density gain; tighter 3D bonding next for 2027
Huawei has begun mass-producing its Kirin 9050 series with LogicFolding, a 3D chip architecture that improves transistor density and computing efficiency without relying solely on...