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Wednesday 9 September 2026
Axcelis to build new Korea manufacturing site in US$35 million expansion
Axcelis Technologies plans to invest US$35 million in a new semiconductor equipment manufacturing facility in Pyeongtaek, South Korea, a move that could help strengthen global chip...
Wednesday 9 September 2026
Huawei orchestrates China's DUV lithography push to cut reliance on ASML
Huawei is emerging as a central organiser of China's effort to build a domestic semiconductor equipment supply chain, backing critical lithography suppliers and helping connect them...
Wednesday 9 September 2026
LG Innotek tackles glass substrate microcrack issue as 2028 production race heats up

LG Innotek is applying internally developed artificial intelligence to semiconductor glass substrate manufacturing, targeting microcracks,...

Wednesday 9 September 2026
SEMIFIVE begins HyperAccel chip production on Samsung 4nm as capacity tightens
SEMIFIVE has begun mass production of HyperAccel's data center inference accelerator using Samsung Foundry's 4nm process, marking the Korean custom-silicon company's first large-scale...
Wednesday 9 September 2026
India's HCLTech opens semiconductor lab in Bengaluru to serve global chip supply chains
HCLTech has opened a new semiconductor laboratory in Bengaluru, a move that could matter for chipmakers and device makers worldwide as they look for faster testing, qualification,...
Wednesday 9 September 2026
Exclusive Interview: WG Tech sees a faster route for TGV beyond displays

WG Tech (Jiangxi) Group is accelerating its shift from display glass into semiconductor applications, targeting through-glass via (TGV)...

Wednesday 9 September 2026
SDC, LGD target advanced glass packaging
As glass substrates emerge as a next-generation semiconductor packaging material, they have become the centerpiece of the display industry's cross-sector transformation. Although South...
Wednesday 9 September 2026
Backed by Nanya partnership, PieceMakers eyes AI memory upgrade boom
As AI compute requirements scale, memory bandwidth has become a primary bottleneck governing system performance. PieceMakers Technology, which maintains a strategic partnership with...
Wednesday 9 September 2026
Samsung's Taylor fab reportedly fully booked before 2nm production begins
Samsung Electronics' Taylor foundry fab in Texas has reportedly reached full booking before 2nm volume production begins, signaling stronger demand for the company's incoming US advanced-node...
Wednesday 9 September 2026
Indonesia bets on a full EV supply chain as BYD opens its Subang plant

Indonesia's industry minister said the country has the resources to build a complete domestic electric vehicle chain, speaking in Subang,...

Tuesday 8 September 2026
Kian Shen eyes stronger 3Q26 on chassis, lightweight frames, Lean3
Taiwan's Kian Shen is counting on chassis, lightweight panel frames, and the Lean3 electric vehicle to drive growth, with third-quarter 2026 performance expected to improve from the...
Tuesday 8 September 2026
LG's robot actuator push turns appliance know-how into a physical AI supply-chain bet
As humanoid robots increasingly move from demonstrations toward factories and commercial deployments, competition is expanding beyond finished robots into the components that determine...
Tuesday 8 September 2026
US chip tariffs raise stakes for Samsung, SK Hynix's US memory plans
South Korea and the US are discussing semiconductor investments in the US as part of broader bilateral negotiations, bringing US chip tariff policy closer to the investment decisions...
Tuesday 8 September 2026
Samsung boosts Galaxy A series output as rivals cut lower-end phones
Samsung Electronics has moved to expand production of mid- to low-end smartphones from August to November 2026, according to South Korean media Maeil Business Newspaper. The...
Tuesday 8 September 2026
ChenFull Precision expands from defense and semiconductor equipment into quantum computing
ChenFull Precision has expanded rapidly in recent years from traditional precision manufacturing operations such as welding and surface treatment into the semiconductor process equipment...