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Monday 5 January 2026
Taiwan fortifies silicon shield with 2026 push to set global chip agenda
As AI server and semiconductor companies look set to close out a profitable 2025, recent Chinese military encirclement exercises and live-fire drills around Taiwan have once again...
Monday 5 January 2026
SK On slows investment and delays Seosan factory expansion with EV market uncertainty
SK On, a battery unit of SK Innovation, has scaled back its investment plans and postponed the expansion of its new factory in Seosan, Chungcheongnam-do, South Korea, due to a slowdown...
Monday 5 January 2026
Taiwan ramps up drone procurement in 2026, testing mass-production capacity
Taiwan is set to dramatically scale up its military drone production starting in 2026 as the Ministry of National Defense prepares to order nearly 50,000 units, a move intended to...
Monday 5 January 2026
Neuralink moves toward brain implant mass production in 2026

Elon Musk said Neuralink plans to begin high-volume production of its brain-computer interface implants in 2026 and shift to an almost...

Saturday 3 January 2026
Micron and GlobalFoundries strengthen Singapore's position in advanced AI chip manufacturing
Singapore is drawing a new wave of semiconductor investment as global chipmakers expand advanced manufacturing tied to artificial intelligence infrastructure, reinforcing the city-state's...
Friday 2 January 2026
IC substrates and networking PCBs grow; materials and equipment face shortages
The PCB industry is making large upgrades. The largest beneficiaries of the AI boom are IC substrate makers that are part of the advanced chip packaging supply chain, such as Unimicron...
Friday 2 January 2026
US approval of TSMC equipment exports to China reflects strategy shift
Following reports that the US government had granted annual export licenses to South Korea's Samsung Electronics and SK Hynix, the US Department of Commerce (DOC) has also approved...
Friday 2 January 2026
China's CXMT moves toward IPO with global DRAM share nearing 4%
China's leading DRAM producer, ChangXin Memory Technologies (CXMT), has entered the initial public offering phase as it targets a rapid increase in global market share, aiming to surpass...
Friday 2 January 2026
Samsung reportedly seals land deal, paving way for Yongin semiconductor complex
Samsung Electronics has taken a key step toward building a massive semiconductor manufacturing complex in Yongin after finalizing a land purchase for a national industrial park, moving...
Friday 2 January 2026
Samsung aims for 2026 HBM4 mass production after customer validation
Samsung Electronics plans to begin mass production of its sixth-generation high-bandwidth memory chips in 2026, citing positive feedback from customers as the South Korean tech giant...
Friday 2 January 2026
Smartphones and notebook prices could increase as memory lead times extend
Demand for high-bandwidth memory (HBM) is crowding out production capacity for consumer memory. Despite capacity expansions by major memory makers, including Micron, Samsung, and SK...
Friday 2 January 2026
SanDisk, Micron vie for PSMC's Tongluo fab capacity
Market rumors and formal statements indicate two major memory companies, SanDisk and Micron, have approached PSMC about capacity cooperation at PSMC's new 12-inch fab in Tongluo, Taiwan...
Friday 2 January 2026
China demand pushes Nvidia to seek more H200 capacity from TSMC
Nvidia is in talks with TSMC to expand production of its H200 artificial intelligence chips as Chinese technology companies move to secure large orders for 2026, according to Reuters...
Friday 2 January 2026
Intel and Samsung advance 2nm GAA, but yield gaps leave TSMC as the sole external supplier
TSMC has officially commenced volume production of its 2nm (N2) semiconductor process in the fourth quarter of 2025, marking a milestone as the first foundry worldwide to offer chiplet...
Wednesday 31 December 2025
China's CXMT eyes US$4.2B Shanghai IPO to fuel memory chip expansion

China's leading domestic DRAM maker, ChangXin Memory Technologies (CXMT), is seeking to raise CNY29.5 billion (approx. US$4.2 billion)...