Raising backend service quotes is not necessarily the best practice for OSAT firms to counter ever-tighter capacity supply for wire bonding and flip chip packaging, as nothing is...

TSMC plans to launch an enhanced version of 3nm process technology in 2023, with Apple being the initial customer adopting the process, according to industry sources.

Qualcomm has strengthened its ties with Taiwan's semiconductor sector in the wake of the US-China trade war, resulting in increased orders and strong sales for related supply chain...

5G mmWave AiP (antenna in package) modules are on track to gain increasing penetration in handsets and other devices after being incorporated into iPhone 12 series, and FC-AiP technology...

Global tablet shipments amounted to 43.83 million units in third-quarter 2020, up 10.5% on quarter and 0.4% on year.

Taiwan-based IC substrate suppliers including Kinsus Interconnect and Unimicron Technology are expected to gain growth momentum from increasing demand for AiP (antenna in packages)...

Smartphone application processor shipments to China-based vendors amounted to 192.6 million units in third-quarter 2020, up 13.4% quarter-over-quarter and down 9.5% year-over-year.

Handset application processor vendors have expressed concerns about the supply of BT substrates that may fall due to the suspension of production at Unimicron Technology's fire-hit...

Smartphone shipments to the China market in third-quarter 2020 plunged 25.2% on quarter and 26.2% on year due to the US government placing stricter trade sanctions on Huawei and consumer...

IC capacity for leading-edge (sub-10nm) processes is expected to grow and become the largest portion of monthly installed capacity across the industry beginning in 2024, according...

TSMC is in talks with a Korean client for manufacturing OLED driver ICs using the foundry's 28nm high-voltage process, according to industry sources.

ASE Technology's development of its CMOS image sensor backend business has been in a low profile, unlike the development of its other offerings such as wirebonding and system-level...

A new wave of price hikes for high-end IC substrates, ranging from 20-40%, has emerged following a recent fire damaging a plant of Taiwan's Unimicron Technology, with clients rushing...

Qualcomm and MediaTek are poised to embrace strong shipment growths for 5G SoC solutions in 2021 as sales of 5G phones are expected to grow exponentially in the coming year, particularly...

In the "Insights 2020: Women in Startups" virtual forum co-hosted by Qualcomm Incorporated and Taipei Computer Association (TCA) on October 15, Varsha Tagare, senior director, Qualcomm...

Taiwan's backend houses ASE and affiliated Siliconware Precision Industries (SPIL) reportedly have landed orders for Qualcomm's Snapdragon X60 modem chips while GaAs foundry Win Semiconductors...

Qualcomm and MediaTek both are ramping up their orders at wafer foundry houses and IC backend service suppliers as they plan to roll out their respective next-generation 5G chips...

TSMC has seen capacity utilization rates for 28nm process technology surge and come to nearly 100% in the fourth quarter of 2020, thanks to the bulk of orders transferred by Qualcomm...

Unimicron Technology's IC substrate plant in Taoyuan, northern Taiwan caught fire on the afternoon of October 28. The site is where the company produces flip-chip chip-scale packaging...

Following three consecutive years of declines in 2018-2020, global smartphone shipments are expected to grow by a double-digit rate or 150 million units in 2021.

Huawei will see its tablet shipments in 2021 undermined by the US trade sanctions as the Chinese brand is unable to obtain processors from Qualcomm or MediaTek, or outsource in-house...

Intel has agreed to sell its NAND flash and storage business to SK Hynix, but the chipmaker is also facing increasingly intense competition from AMD, Nvidia and even Apple in its...

A growing number of Taiwan-based network equipment suppliers have ramped up shipments of 5G CPE (customer premise equipment) products to the markets in Europe and the US starting...

Acer has announced its latest notebooks, monitors and projectors as well as its first Chromebook that is equipped with an Arm-based processor.

Micron Technology has announced the launch of uMCP5, which the company claims is the industry's first universal flash storage (UFS) multichip package with low-power DDR5 DRAM.