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NEWS TAGGED QUALCOMM TECHNOLOGIES
Wednesday 13 March 2024
LGES, Qualcomm Technologies to develop BMS with 80X increase in computing power
Battery maker LG Energy Solution announced that it will collaborate with Qualcomm Technologies to work on advanced Battery Management System (BMS) diagnostic solutions for EV batte...
Wednesday 25 October 2023
Micron collaborates with Qualcomm to accelerate generative AI
Micron Technology has announced that production samples of its low-power double data rate 5X (LPDDR5X) memory, which the company claims is the industry's only 1-beta mobile-optimized...
Wednesday 15 March 2023
Taiwan supply chain critical to AI ecosystem, says Qualcomm executive
Taiwan already plays an important role in the global PC supply chain and will be critical to the AI ecosystem, according to Kedar Kondap, SVP and GM of compute and gaming at Qualcomm...
Friday 30 September 2022
Qualcomm steps further toward commercialization of 5G O-RAN
Qualcomm Technologies, a subsidiary of Qualcomm, has begun to send samples of Qualcomm X100 5G RAN accelerator card and Qualcomm QRU100 5G RAN platform to global customers and partners...
Wednesday 17 November 2021
Qualcomm, BMW team up for automated driving
Qualcomm has announced a collaboration to bring the latest advancements in driver assistance technologies and products of its Snapdragon Ride Platform to BMW Group's next generation...
Thursday 16 September 2021
GF, Qualcomm team up for advanced 5G RF front-end devices
GlobalFoundries (GF) has announced the foundry is continuing its partnership with Qualcomm, expanding their RF collaboration on 5G multi-Gigabit speed RF front-end products.
Wednesday 2 June 2021
Micron intros 176-layer NAND, 1α DRAM technology
Micron Technology has unveiled memory and storage innovations across its portfolio based on its 176-layer NAND and 1α (1-alpha) DRAM technology, as well as what the company...
Wednesday 21 October 2020
Micron uMCP5 ready for mass production
Micron Technology has announced the launch of uMCP5, which the company claims is the industry's first universal flash storage (UFS) multichip package with low-power DDR5 DRAM.
Tuesday 7 July 2020
Soitec announces POI substrates business agreement with Qualcomm for 5G RF filters
Soitec has announced a business agreement with Qualcomm Technologies on the supply of piezoelectric-on-insulator (POI) engineered substrates for 4G and 5G RF filters. Soitec's piezoelectric-on-insulator...
Monday 22 June 2020
Askey announces development of small cell solutions utilizing Qualcomm 5G RAN platform
Askey, a Taiwan-based ICT solutions provider for businesses and service providers, announced plans to develop 5G mmWave and sub-6GHz small cell products for public venues and private...
Research Report Database
Summary of Tech Supply Chain News!
Operation O-RAN: The US plan to neutralize Huawei (and why it will work)
DIGITIMES Insight: Nvidia's path to US$100 billion in sales
Server air cooling turning to 3D VC solutions for better efficiency, says DIGITIMES Research