Samsung Electronics is reportedly promoting Molded Underfill (MUF) materials in its advanced packaging processes. Since SK Hynix has already adopted MUF technology for its High Bandwidth...

The memory industry is set to exit the production cut phase as Generative AI superpowers high bandwidth memory (HBM) and DDR5 demand.

The high, double-digit annual shipment growth rate of foldable smartphones has caused the market to view it as a crucial product line that will drive the turnaround in overall smartphone...

Samsung Electronics is reportedly accelerating automation innovation in its production lines to cope with the memory market downturn and labor shortages. By using manufacturing equipment...

These are the most-read DIGITIMES Asia stories from February 26 – March 1.

Congressional Democrats demanded in a letter Thursday that the Biden administration add more labor protections to its initiative aimed at boosting US semiconductor production.

Micron Technology unveiled at MWC 2024 that the forthcoming flagship smartphones from Honor and Samsung will feature the company's Universal Flash Storage (UFS) 4.0 mobile flash storage...

Samsung is engaged in fierce HBM competition with Micron.

China-based smartphone brands have made a splash at this year's Mobile World Congress (MWC, seizing the opportunity to make a strong impression in the European market. At MWC 2024,...