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NEWS TAGGED SEMCO
Friday 17 September 2021
AiP substrate shipments for new iPhones set to rise
Suppliers of antenna-in-package (AiP) substrates for Apple's new iPhones are gearing up for a ramp-up in demand for mmWave models, according to industry sources.
Wednesday 30 June 2021
Apple reportedly enlists five suppliers of AiP substrates for new mmWave iPhnones
Apple reportedly has enlisted AT&S as a new supplier of BT-based AiP (antenna in package) substrates for new 5G mmWave iPhones to be released later in the year, expanding to five...
Monday 28 June 2021
Intel, AMD, Nvidia in keen competition for ABF substrate capacity
Intel, AMD and Nvidia are heating up competition to win more capacity support from suppliers of ABF substrates needed to process their HPC chips through at least 2025, according to...
Thursday 24 June 2021
BT substrate suppliers kicking off shipments for new Apple devices
BT substrate vendors in the supply chain of Apple devices are all gearing up shipments for next-generation Apple Watch, AirPods and iPhone devices, which will all massively adopt...
Tuesday 25 May 2021
IC substrate supply to stay constrained in 2021-2022
The global supply of IC substrates will not see major inprovement until late 2021 or 2022 when Taiwan-based suppliers' additional capacity comes online, according to industry sourc...
Friday 23 April 2021
Nichidenbo upbeat about passive component demand for 5G, EV
Taiwan-based Nichidenbo, which distributes capacitors, MLCCs and other passive components for vendors such as Nippon Chemi-Con and Samsung Electro-Mechanics (Semco), has expressed...
Friday 9 April 2021
AiP substrates in growing demand for new mmWave iPhones in 2021
IC substrate makers in Apple's iPhone supply chain are aggressively bracing for production of BT-based AiP (antenna in package) substrates expecting a surge in demand for new iPhones...
Friday 19 March 2021
Japan, Korea PCB makers shifting production focus to IC substrates
PCB makers in Japan and South Korea have been shifting production focus to IC substrates from segments of traditional multi-layer rigid boards and even higher-end HDI, flexible PCB...
Monday 22 February 2021
Chipmakers placing extra orders for BT substrates amid tight supply
As supply of high-end BT substrates has turned tight in the first quarter of 2021, major chipmakers including Qualcomm and MediaTek are moving aggressively to secure more capacity...
Friday 19 February 2021
Tape COF substrate demand picking up
Taiwan-based Chipbond Technology and JMC Electronics have both seen orders for tape COF substrates pick up substantially, reflecting limited capacity supply for such substrates and...
Wednesday 25 November 2020
Taiwan IC substrate suppliers gearing up for mmWave AiP modules
Taiwan-based IC substrate suppliers including Kinsus Interconnect and Unimicron Technology are expected to gain growth momentum from increasing demand for AiP (antenna in packages)...
Friday 20 November 2020
Concerns rising over tight BT substrate supply for handset SoCs
Handset application processor vendors have expressed concerns about the supply of BT substrates that may fall due to the suspension of production at Unimicron Technology's fire-hit...
Thursday 19 November 2020
Semco reportedly to exit rigid-flex PCB segment
Samsung Electro-Mechanics (Semco) reportedly will phase out its rigid-flex PCB (RFPCB) business in 2021 amid unfavorable factors on both the supply and demand sides, according to...
Thursday 27 August 2020
Taiwan makers poised to scale up AiP substrate shipments in 2021
Taiwan-based IC substrate makers Unimicron, Nan Ya PCB and Kinsus Interconnect are expected to significantly scale up their AiP (antenna-in-package) substrate shipments in 2021, driven...
Tuesday 18 August 2020
Daeduck to expand ABF substrate capacity for Samsung demand
Korea-based PCB maker Daeduck Electronics, a supplier of Samsung Electronics, will invest KRW90 billion (US$76 million) to expand ABF substrate capacity, according to industry sour...