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Monday 30 September 2024
Entering the trillion-transistor era: A semiconductor revolution unfolds
In early September, SEMICON Taiwan 2024 was held in Taipei. This annual global semiconductor event gathered leading semiconductor companies and industry elites from around the world...
Monday 30 September 2024
Targeting GAFAM: Japan's semiconductor alliance fuels innovation, redefining global supply chains
Amid intensifying competition in the global semiconductor market, the Japanese government has relaunched its semiconductor industry revival plan, prioritizing advanced technology...
Monday 30 September 2024
Canon begins shipping nano-imprint lithography to US customer
Canon has announced its first customer for the nano-imprint lithography (NIL) equipment it launched in 2023 for advanced chip manufacturing.
Friday 27 September 2024
Japan's advancements in diamond semiconductor technology could lead to practical applications by 2025-2030
Technological breakthroughs in diamond semiconductors, known for their superior performance despite technical challenges, could lead to practical applications as early as 2025 to...
Friday 27 September 2024
US and India launch national security fab for compound semiconductors amid export control challenges
The US and India recently announced the establishment of a national security fab dedicated to producing chips using compound semiconductors, marking a significant milestone in India's...
Friday 27 September 2024
Huawei unveils 110-inch AI smart screen, new watch series, and electric SUV as Mate 70 wait continues
Huawei held its fall product launch event on September 24, showcasing several key products, including the 110-inch Smart Screen V5 Max 110, the Watch GT 5 smartwatch series, and the...
Friday 27 September 2024
Darwin Precisions charts path for steady growth through diversification for AI PCs 2025
According to Michael Tsai, Chairman of Darwin Precisions (Darwin), the leading backlight module company, the firm is on a steady growth trajectory as it implements its new business...
Friday 27 September 2024
Color-changing e-paper to commercialize and possibly launch in 2025
E Ink's color-changing e-paper has garnered significant attention since it collaborated with BMW, attracting interest for various products, although these collaborative products remain...
Friday 27 September 2024
PSMC and Tata finalize fab cooperation, Modi commits to two key promises to Frank Huang
Powerchip has announced the signing of a definitive agreement with Tata Electronics in New Delhi. Under the agreement, Powerchip will assist Tata Electronics in constructing India's...
Thursday 26 September 2024
US defense delegation seeks drone partnerships in Taiwan amid new industry alliance
In a significant move to strengthen defense ties, a US drone and counter-drone delegation recently visited Taipei, exploring supply chain collaboration with Taiwan's burgeoning unmanned...
Thursday 26 September 2024
LTPO backplanes trends upward after gaining favor from Huawei, Apple
Before 2020, almost all smartphones incorporated LTPS technology for their AMOLED panels. However, many manufacturers are turning to LTPO, especially now that generative AI (GenAI)...
Thursday 26 September 2024
Taiwan ramps up semiconductor innovation with US$9.3 billion initiative and global talent drive
At its September 19 board meeting, Taiwan's Central Bank emphasized Taiwan's critical role in maintaining its semiconductor dominance amid escalating US-China trade tensions in technology...
Thursday 26 September 2024
GenAI driving home appliance innovation and expansions
As Generative AI (GenAI) technology matures and its functions improve, businesses are exploring new applications beyond traditional devices. While GenAI has already made inroads into...
Thursday 26 September 2024
US DOC imposes ban on Chinese automotive software and hardware
The US Department of Commerce (DOC) recently proposed a ban on automotive software and hardware technology and equipment from China and Russia entering the US market. Sino Auto Insights...
Thursday 26 September 2024
SK Hynix begins volume production of 12-layer HBM3E
K Hynix has commenced mass production of the world's first 12-layer HBM3E product, boasting a 36GB capacity, the highest of any current HBM available, according to the memory chip...