ASE Technology and its EMS subsidiary Universal Scientific Industrial (USI) have reportedly grabbed major system-in-package (SiP) orders for the new Apple Watch Series 6 and Apple...

As the world emerges from the COVID-19 crisis, it is likely to leave lasting impacts not only on the patients who have been treated by dedicated doctors and nurses, but also generally...

Samsung is stepping up its deployments in the 3D IC packaging field, looking to compete against TSMC starting 2022 for advanced chip packaging in-house, according to industry obser...

Samsung Electronics has announced the immediate availability of its silicon-proven 3D IC packaging technology, eXtended-Cube (X-Cube), for today's most advanced process nodes.

Fitbit has launched the Fitbit Flow, a low-cost emergency ventilator with Inventec Appliances reportedly being the sole supplier, according to sources from the upstream supply chai...

Leading IC backend house ASE Technology Holding saw its revenues for both second-quarter and first-half 2020 hit record highs, thanks mainly to high capacity utilization for wire...

HannStar Display has further optimized its product mix for 2020, focusing on panels for IoT and wearable applications, while reducing those for smartphone applications, according...

Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced the introduction of new HyperRAM products with WLCSP, which reaches an...

Taiwan-based PCB maker Compeq Manufacturing has announced its first-quarter net earnings shot up 195.74% on year to NT$929 million (US$31.13 million) on revenues of NT$12.09 billion,...

The coronavirus crisis will undercut growth in the global semiconductor business in 2020, with the looming threat of global recession prompting Omdia to slash its market forecast...

The worldwide market for wearable devices grew 82.3% in the fourth quarter of 2019, reaching a new high of 118.9 million devices shipped, according to IDC.

The global market for TWS earbuds and other devices has been expected to expand sharply in 2020, but certain component shortages due to the coronavirus outbreak are hitting its supply...

Leading original equipment manufacturers (OEMs) reduced their semiconductor spend in 2019, influenced by declining memory prices, according to Gartner. Apple took the top rank from...

The just-concluded CES 2020 has witnessed diverse new tech innovations and applications, such as wearable devices focusing more on diverse health monitoring, AR/VR gears incorporating...

Taiwan-based ODM Inventec expects each of its three major product lines to register about 10% revenue expansion in 2020 and a higher growth in 2021, with plans to simultaneously expand...

Compal Electronics expects its notebook shipments to register only flat growth on year in 2020, but shipments of its non-notebook products such as wearables, smart home devices, automotive...

Despite a truce in the US-China trade war, notebook ODMs will continue their capacity relocation to Taiwan and Vietnam, with the two becoming their major production bases outside...

Notebook ODMs saw weaker-than-expected shipments in fourth-quarter 2020 due to Intel CPU shortages and clients' high inventory levels as a result of their early inventory build-ups...

Worldwide first-tier ODMs and EMS providers including Quanta Computer, Pegatron, Wistron and Flextronics have begun crossing into the manufacturing of augmented reality (AR) glasses,...

Huawei has a low-profile display at CES 2020, showcasing mostly existing products, such as the P30 Pro smartphone, the foldable Mate X, tablets and wearable, without unveiling any...

Taiwan PCB makers are expected to maintain strong shipments of rigid-flex boards at least throughout the first half of 2020 to meet robust demand for AirPods 2 and other TWS (true...

Chinese PCB maker Kinwong Electronic and Taiwan-based peer Plotech Technology have both disclosed plans to set up new production lines for HDI boards in China seeking to cash in on...

The global market for wearables is on track to ship 305.2 million units in 2019, up 71.4% from the 178 million units shipped in 2018, according to IDC. From there, total volumes will...

Apple has informed its upstream partners it will stop paying non-recurring engineering (NRE) fees for the development of new iPhones' chassis and metal frames, according to industry...

While SiP substrates are increasingly needed to support function upgrades on wearables, TWS earbuds and other devices, rigid-flex PCBs will firmly stay as mainstream applications...