CONNECT WITH US
NEWS TAGGED GAA
Friday 16 February 2024
Applied Materials sees faster recovery in semiconductors, to benefit from HBM and GAA equipment
Applied Materials reported an 18% growth in its profit and expected the semiconductor industry to recover faster than the macroeconomy. The company said it will likely benefit from...
Friday 19 January 2024
Samsung enters trial production for 2nd-gen 3nm process, aiming for over 60% yield within 6 months
Samsung Electronics is reportedly entering trial production for its second-generation 3nm process technology to compete with TSMC and attract customers. With subsequent yield and...
Monday 15 January 2024
TSMC reportedly achieves smooth implementation of GAA for 2nm process
Taiwan Semiconductor Manufacturing Company (TSMC) is on schedule to implement its 2-nanometer node with the Gate-All-Around (GAA) technology, according to its supply chain partners,...
Friday 1 December 2023
TSMC likely to win it all, with Samsung's 3nm reportedly losing several significant orders
Despite its attempt to catch up with TSMC, Samsung Electronics is rumored to have recently lost several significant orders for its 3nm process. The South Korean industry believes...
Tuesday 28 November 2023
Samsung unveils ambitious 'GDP' semiconductor strategy targeting AI market growth
Samsung Electronics executives have recently disclosed their 2024 semiconductor strategy, named "GDP" (Gate-All-Around, DRAM, and Packaging), at an investors forum, aiming to tap...
Friday 27 October 2023
Samsung plans to increase GAA lead with 1.4nm mass production in 2027
It's reported that Samsung Electronics is looking to widen its lead in Gate-All-Around (GAA) platform. The plan is to increase the number of nanosheets from three to four starting...
Tuesday 17 October 2023
Hybrid bonding technology crucial for realizing 3D DRAM
Some predictions suggest that as DRAM technology development is gradually approaching a bottleneck, hybrid bonding technology may be introduced into future DRAM manufacturing processes...
Tuesday 8 August 2023
Samsung secures 3nm GAA new orders amid persisting foundry revenue challenges
According to Business Korea, there are rumors suggesting that Samsung foundry, including its System LSI division, may experience losses of up to 1 trillion KRW (approximately...
Friday 28 July 2023
Samsung on track to expand memory production cutbacks in 2H23
Samsung Electronics is on track to expand production cutbacks on both DRAM and NAND flash chips to accelerate a memory market rebound in the second half of 2023, after its Device...
Thursday 27 July 2023
Samsung reportedly investing in R&D for 3D stacking GAA technology
After memory products like NAND Flash and DRAM, it's reported that Samsung Electronics will conduct R&D for a "3D stacking" technology that can vertically stack system semiconductor...
Wednesday 19 July 2023
Improving Samsung's GAA production yields seen a lengthy and laborious process
From the perspective of foundries, increasing Samsung's yields of GAA (gate-all-around) transistor production would be a lengthy and laborious process that appears to be considerably...
Wednesday 19 July 2023
TSMC will lead 3nm process market, as TechInsights report reveals
TSMC can temporarily exhale a breath of relief as the efficacy of Samsung's 3nm GAA technology has been revealed by a recent TechInsights study, according to sources at fab toolmak...
Monday 3 July 2023
Samsung set to commercialize 2nm chips in 2025, 1.4nm by 2027
Samsung Electronics has disclosed its latest advanced process development roadmap at the just-ended 2023 Samsung Foundry Forum, with plans to mass produce 2nm chips by 2025 and commercialize...
Thursday 15 June 2023
3D DRAM to see clear development direction in next 2-3 years
Samsung Electronics and SK Hynix have revealed the latest development trends for advanced logic chips technology and memory products at recent technology symposiums, with the former...
Wednesday 7 June 2023
Intel announces backside power solution breakthrough
Intel made public a new approach to both how chips are made and how they are tested. For the first time, chipmaking is going two-sided, according to an Intel press release.