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Saturday 13 September 2025
Micron courts Trump policies to challenge Korean memory giants
Micron Technology is reportedly deepening its ties with the Trump administration to secure a stronger foothold in the global semiconductor market. According to South Korean media,...
Friday 12 September 2025
South Korea targets massive hydrogen market, aiming to become global leader by 2030
The South Korean government is accelerating the development of its hydrogen economy, focusing on three key policy directions: demand market expansion, supply planning, and infrastructure...
Friday 12 September 2025
Nvidia reportedly asks Samsung to double GDDR7 memory orders
Nvidia has reportedly requested Samsung Electronics Co. to significantly expand its procurement of GDDR7 graphics memory, a move expected to enhance Samsung's memory business revenue...
Friday 12 September 2025
Oracle rides AI wave with massive contracts and bullish outlook
Oracle is rapidly shaking off its reputation as a laggard in cloud computing, with new AI contracts and a strong outlook pushing its growth plans into overdrive.
Friday 12 September 2025
TASC said to supply PDs for AirPods Pro 3 for heart rate sensing
Apple's new generation AirPods Pro 3 earbuds are reportedly equipped with a photo detector (PD) in each unit, built by Taiwan-Asia Semiconductor (TASC), allowing the Taiwanese company...
Friday 12 September 2025
Alibaba Group to raise US$3.17 billion via convertible bonds for cloud infrastructure expansion
Alibaba Group has announced plans to raise US$3.17 billion through zero-coupon convertible bonds, the largest transaction of its kind this year. The funds will primarily support the...
Friday 12 September 2025
Power Emerges as Key Bottleneck for AI, Driving Global Semiconductor Collaboration

As the semiconductor market accelerates toward an estimated US$1.3 trillion valuation by 2030, industry leaders are converging on a shared vision. AI is ushering in...

Friday 12 September 2025
China's self-sufficiency agenda spurs JPT's leap into optical inspection

Shenzhen JPT Opto-Electronics, a well-established name in China's laser industry, is expanding into optical inspection as Beijing's push...

Friday 12 September 2025
Samsung to debut tri-fold phone as early as October, 50K units to hit Korea and China first
Samsung Electronics' new tri-fold smartphone has received Korea Certification (KC) approval, signaling that its launch is imminent. Building on the strong sales momentum of the Galaxy...
Friday 12 September 2025
Advantest tops TEL in market value after 19 years, driven by AI chip testing boom
Japanese chip testing equipment giant Advantest has overtaken Tokyo Electron (TEL) in market capitalization for the first time in nearly two decades, signaling a shift in the balance...
Friday 12 September 2025
Connected car risks stall EV adoption at 'last two miles'
At IAA Mobility 2025 (September 9-14), electrification once again dominates the global automotive conversation, with China, Europe, and the US racing to secure market leadership....
Friday 12 September 2025
SEMICON Taiwan 2025: Hanmi Semiconductor unveils large 2.5D packaging equipment
The rising demand for AI servers and high-end GPUs has fueled growth in large-size 2.5D interposers, and Hanmi Semiconductor is moving quickly to capture this opportunity. At SEMICON...
Friday 12 September 2025
Infineon targets 2028 for RISC-V automotive chip rollout
At the OktoberTech Taipei event held on September 11, 2025, Infineon Technologies AG unveiled key developments in its automotive electronics portfolio, with CEO Jochen Hanebeck and...
Friday 12 September 2025
SEMICON Taiwan 2025: Hanwha Semitech maps out roadmap for advanced packaging equipment with 2026 launch plans
Hanwha Semitech has announced a new strategic roadmap to strengthen its position in the advanced semiconductor packaging equipment market, unveiling next-generation systems set to...
Friday 12 September 2025
SK hynix Completes World's First HBM4 Development and Readies Mass Production
Seoul, September 12, 2025 – SK hynix Inc. announced today that it has completed development and finished preparation of HBM4, a next generation memory product for ultra-high...