TSMC is accelerating its advanced packaging roadmap for AI chips, expanding CoWoS capacity while publicly disclosing new progress in...

Japan's Rapidus has signed a memorandum of understanding with the UK Semiconductor Centre, a government-backed body established in 2025...

Physical AI is emerging as a new frontier of model development. Any model, however, is only as good as the data used to train it. Because...

Malaysian Prime Minister Anwar Ibrahim concluded a three-day visit to Japan, during which he met with Japanese Prime Minister Sanae...

NTT plans to establish an investment fund of more than JPY70 billion (approx. US$440 million), with major South Korean and Taiwanese...

DRAM prices are climbing as Samsung Electronics, SK Hynix, and Micron Technology prioritize high-bandwidth memory, or HBM, for AI applications,...