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Thursday 2 October 2025
China to give local products 20% edge in govt purchases
Starting January 1, 2026, China will give domestic products a 20% price advantage in government procurement to support local AI chipmakers, promoting self-reliance, though advanced...
Thursday 2 October 2025
Huawei announces Meng Wanzhou as rotating chair
Meng Wanzhou, Huawei's vice chairperson and CFO, will assume the role of rotating chairperson from October 1, 2025, to March 31, 2026, according to Huawei's official website. She...
Thursday 2 October 2025
Analysis: Trump's chip probe threatens to backfire on America
The Trump administration's investigation into semiconductor imports has unleashed deep uncertainty across the global tech industry—and the fallout may hit American companies...
Thursday 2 October 2025
US proposed chip manufacturing ratio raises Malaysia trade concerns
The US government is reportedly weighing a policy that would require companies to manufacture and import semiconductor chips in the US on a 1:1 ratio, with additional tariffs imposed...
Thursday 2 October 2025
Rumored Intel-AMD foundry deal signals potential shift in chipmaking landscape
Intel is reportedly in early talks to manufacture chips for rival AMD, Semafor revealed, a move that could boost confidence in Intel's struggling foundry business. While...
Thursday 2 October 2025
OpenAI CEO's Korea visit leads to memory supply pact and AI data center plan
OpenAI CEO Sam Altman arrived in South Korea on October 1 to advance cooperation agreements with leading conglomerates SK Group and Samsung. His visit included meetings with SK chairman...
Thursday 2 October 2025
Stable NT$ boosts Taiwan exporters in 4Q25
Since US President Donald Trump took office on January 20, 2025, the global trade order and long-established supply chain balances have been disrupted. Taiwan has stood out amid the...
Wednesday 1 October 2025
Samsung advances Exynos 2600 production as 2nm yield rises to 50%
Samsung Electronics has begun mass production of its next-generation application processor (AP), the Exynos 2600, which is expected to power the standard models of the Galaxy S26...
Wednesday 1 October 2025
Taiwan rejects US proposal for 50-50 chip production split
US Secretary of Commerce Howard Lutnick recently proposed a 50-50 split in chip manufacturing between Taiwan and the US, claiming the US is nearing major tariff and semiconductor...
Wednesday 1 October 2025
Japan's Nichia taps Taiwanese executive for top post as part of semiconductor push
Japanese LED leader Nichia has promoted Taiwan-born executive Tsun-Chia Tai to senior managing director, a move effective October 1 that makes him the highest-ranking Taiwanese manager...
Wednesday 1 October 2025
Taiwan-US trade talks slow due to unresolved semiconductor tariff disputes
The ongoing negotiations between Taiwan and the US for a trade agreement have been hindered by unresolved differences over semiconductors, slowing progress despite several rounds...
Wednesday 1 October 2025
Intel & TSMC invest billions to transform Arizona into semiconductor powerhouse
More and more tech giants have followed TSMC's lead after its announcement of a US$165 billion investment to build more plants in Arizona. A half mountain, half desert state is slowly...
Wednesday 1 October 2025
TSMC reports US$6.63 billion in global tax payments for 2024, majority paid in Taiwan
TSMC disclosed in its 2024 sustainability report that it paid a total of NT$202 billion (US$6.63 billion) in taxes worldwide, with Taiwan accounting for nearly 95% of the amount....
Wednesday 1 October 2025
Five major pressures plaguing TSMC as US government pushes for 50-50 production split
The Trump administration pushed for a 50-50 split in chip manufacturing between the US and Taiwan, pressuring TSMC to expand US production. This raises costs and risks for Taiwan's...
Wednesday 1 October 2025
China's 12-inch SiC leap: SICC, Jingsheng in spotlight
The global race in third-generation semiconductors is intensifying, with larger silicon carbide (SiC) wafers seen as critical to cutting costs and enhancing power device performance...