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Friday 28 August 2026
Exclusive: IC design faces wire bonding bottleneck in 2027
Surging AI chip demand continues to outstrip TSMC's advanced packaging capacity. At the same time, massive AI server shipments are driving up demand for CPUs, networking equipment,...
Friday 28 August 2026
Samsung absorbs memory costs to chase smartphone crown
Global smartphone shipments are set to shrink sharply in 2026 as soaring memory and core component prices hit the market, but Samsung Electronics is moving in the opposite direction...
Friday 28 August 2026
Global LCD TV shipments above 70 inches rise as large-screen prices fall
Global shipments of LCD TVs larger than 70 inches have climbed sharply over the past four years, with models above 98 inches rising 12-fold, according to a Nikkei report citing...
Thursday 27 August 2026
HP revenue hits record as PC shipments fall on rising component costs
HP reported record revenue in the third quarter of fiscal 2026, but PC shipments declined as higher average selling prices weighed on unit volume. The company said the same pattern...
Thursday 27 August 2026
Tri-fold, rollable foldables intensify materials supply chain battle
Samsung Electronics' first tri-fold handset of 2025, the Galaxy Z TriFold, has repeatedly sold out, but with global shipments of only about 30,000 units, it functioned more as a technology...
Thursday 27 August 2026
China OLED buildout lifts Korean equipment sales as backlogs grow
Chinese panel makers' investment in next-generation OLED production is beginning to translate into reported sales at South Korean equipment suppliers, with several vendors posting...
Thursday 27 August 2026
Analysis: Smartwatch demand set to outpace broader hardware market in 2026
Smartwatch shipments are expected to continue rising faster than broader IT hardware in 2026, even as smartphones and notebook PCs see weaker growth due to higher memory costs. For...
Thursday 27 August 2026
Nvidia reportedly shifts HBM4 mix toward 8-high as memory supply stays tight

Nvidia has reportedly asked Samsung Electronics and SK Hynix to increase the share of 8-high products...

Thursday 27 August 2026
Ligitek skips 800G, targets 1.6T silicon photonics
Ligitek Electronics, a Taiwan-based LED packaging maker, has expanded in recent years into semiconductor system-in-package (SiP) and silicon photonics. The company said AI-related...
Wednesday 26 August 2026
YMTC targets global NAND lead by 2027 as parent seeks US$5 billion IPO
Yangtze Memory Technologies (YMTC) is aiming to become the world's largest NAND flash supplier by the end of 2027, setting an aggressive target as its parent prepares a nearly US$5...
Wednesday 26 August 2026
Eternal Materials reports July revenue gain as advanced packaging demand strengthens
Eternal Materials said July marked the start of its traditional peak season, with stronger shipments across its three main business units lifting monthly revenue to NT$4.093 billion...
Wednesday 26 August 2026
BOE, 3M expand materials partnership as foldable OLED competition intensifies
BOE Technology Group and 3M have opened a joint research laboratory in Beijing that covers optical films, optically clear adhesives, structural adhesives and advanced materials development...
Wednesday 26 August 2026
Samsung Display boosts OLED sales as Galaxy Z panel orders triple
The global small-size OLED market was flat in the second quarter of 2026 as seasonal weakness and cautious inventory management by Chinese device makers slowed demand. Samsung Display,...
Tuesday 25 August 2026
Eva Air green transport pact to cut Microsoft freight emissions by 15,000 tonnes
Eva Air and AIT Worldwide Logistics have signed a memorandum of understanding to launch a green transport program that will use sustainable aviation fuel from Formosa Petrochemical...
Tuesday 25 August 2026
Intel x86 share drops below 70% as AMD reaches a record high
Intel's long-running lead in x86 processors slipped below a major threshold in the second quarter of 2026, even as AI infrastructure spending helped support demand. New market data...