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Thursday 17 September 2026
Samsung expands SRAM, IP to speed chip development

Memory shortages and pricing pressures are reshaping Samsung Electronics' foundry intellectual property (IP) development, as faster...

Thursday 17 September 2026
AI's memory appetite is squeezing the electronics industry from the bottom up, Intel warns

Fast-moving advances in chip production have spurred a semiconductor boom, markedly altering the manufacturing scope of the broader...

Thursday 17 September 2026
Huawei Connect 2026: Ascend 960 puts industry-first NPO supernode at heart of Huawei's AI scale-up bet
Huawei has unveiled its next-generation Ascend 960 supernode, positioning near-packaged optics (NPO) at the centre of its effort to scale AI computing beyond the limits of individual...
Thursday 17 September 2026
Huawei sees AI agents driving 90% of token traffic by 2035

Huawei expects autonomous AI agents to become the dominant source of AI traffic over the next decade, creating a sharp increase in demand...

Thursday 17 September 2026
Foxconn links FII and FIT to tackle AI infrastructure beyond the chip
Foxconn Industrial Internet (FII) chairman Brand Cheng said Foxconn is integrating four core capabilities — technology, manufacturing, management and vertical integration —...
Thursday 17 September 2026
Musk hints at Tesla-SpaceX merger, but the companies are already converging underneath
The broader high-tech landscape has wondered for years about the subtle transactions and movements unfolding underneath the enormous technology ecosystem Elon Musk has stitched together...
Thursday 17 September 2026
Intel CEO warns of 2027 memory crunch and tighter CPU supply
AI infrastructure expansion is turning memory supply into a major bottleneck for the semiconductor industry. Intel CEO Lip-Bu Tan warned that the memory shortage in 2027 could be worse...
Thursday 17 September 2026
Huawei's 3D data center redesign targets the next AI compute density wall
Huawei has unveiled what it calls the world's first 3D data center, introducing a vertically stacked four-layer architecture designed for increasingly dense AI computing clusters and...
Wednesday 16 September 2026
DIGITIMES Insight: Google outlines AI compute expansion, speeds TPU cycle to 6 months

DIGITIMES Intelligence said Google used SEMICON Taiwan 2026 to outline the direction of its AI infrastructure strategy, focusing not...

Wednesday 16 September 2026
BizLink's CPO breakthrough hits the hard part: scaling
BizLink has begun small-volume shipments of co-packaged optics (CPO), but chairman Roger Liang said mass deployment remains constrained by fiber array unit (FAU) assembly, thermal...
Wednesday 16 September 2026
AI slowdown calls expose the financial strain of the frontier race
Calls to moderate frontier AI development are exposing a financial dilemma alongside the safety debate: AI labs must fund successive research cycles while securing infrastructure to...
Wednesday 16 September 2026
Taiwan CCL makers ride Nvidia's M9 shift as AI servers move to 52-layer PCBs

Global cloud service providers are continuing to expand AI infrastructure, driving a surge in demand for high-frequency, high-speed...

Wednesday 16 September 2026
Astera says customers are rethinking HBM needs for AI accelerators

AI infrastructure customers are starting to reconsider how much high-bandwidth memory (HBM) needs to be placed alongside accelerators...

Wednesday 16 September 2026
Altera confidentially files for US IPO as AI chip demand fuels listing boom

Altera, the programmable-chip maker backed by Silver Lake and Intel, has confidentially filed for an initial public offering (IPO) in the...

Wednesday 16 September 2026
Sharp opens orders for Foxconn-built Nvidia AI servers, targeting JPY250 billion by fiscal 2030
Sharp Corporation began taking orders in Japan on September 15 for AI servers procured from its Taiwanese parent, Foxconn, and equipped with Nvidia processors, giving the display and...