CONNECT WITH US
NEWS TAGGED SPIL
Monday 28 September 2009
SPIL and OSE microSD card packaging to run at full capacity on Samsung orders
Siliconware Precision Industries (SPIL) and Orient Semiconductor Electronics (OSE) recently landed more outsourcing orders for packaging microSD card modules from Samsung Electronics,...
Friday 25 September 2009
MediaTek to shift to 45nm in 1Q10
MediaTek plans to leap to 45nm processing for 3G chips in the first quarter of 2010 despite that volume production of 65nm WCDMA chips is scheduled to begin in the fourth quarter...
Tuesday 8 September 2009
ASE and SPIL monthly sales still down on year, but declines narrowing
Advanced Semiconductor Engineering (ASE) has announced consolidated revenues of NT$8.35 billion (US$254 million) for August, with the on-year decline narrowing to negative 4.9%. Rival...
Friday 21 August 2009
KYEC announces Taiwan Memory investment
Logic IC and memory testing house King Yuan Electronics Company (KYEC) announced on August 20 that its board of directors has approved the investment in Taiwan Memory Company (TMC)...
Thursday 20 August 2009
IC backend suppliers expected to see lower revenues but higher gross margins in 4Q09
Taiwan-based IC packaging and testing service providers are expected to post sequential revenue drops of less than 10% in the fourth quarter of 2009, but overall gross margins may...
Friday 14 August 2009
SPIL board approves investment in Taiwan Memory
Packaging and testing house Siliconware Precision Industries (SPIL) has announced its board of directors on August 13 approved plans to invest in Taiwan Memory Company (TMC), making...
Tuesday 11 August 2009
ASE and SPIL continue to see sales recovery
Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have reported sequential revenue increases from February through July 2009, with smaller on-year...
Monday 3 August 2009
ASE, SPIL to expand high-end process capacity
Advanced Semiconductor Engineering (ASE) plans to increase wire-bond and bumping capacity, and Siliconware Precision Industries (SPIL) will expand its flip-chip (FC) ball-grid array...
Monday 3 August 2009
Top backend houses to see revenues grow in 3Q09
Amkor Technology is expected to see the strongest revenue growth among top packaging and testing houses in th third quarter, followed by Advanced Semiconductor Engineering (ASE),...
Thursday 30 July 2009
SPIL chairman anticipates rising demand from emerging markets in 3Q09
Following a better-than-expected second quarter financial report, IC packaging and testing firm Siliconware Precision...
Wednesday 29 July 2009
SPIL posts 54% sales growth in 2Q09, margins edging up
IC packager Siliconware Precision Industries (SPIL) has announced revenues for second-quarter 2009 grew 53.6% sequentially to NT$14.14 billion (US$430 million), and margins for the...
Monday 27 July 2009
IC backend firms expect 10% revenue decline in 4Q09
IC packaging and testing houses estimate revenues will peak in the third quarter of 2009, and decline 10% in the fourth. Shipment forecasts from foundries show that fourth-quarter...
Monday 20 July 2009
MediaTek to ship 100 million handset chips in 3Q09, says paper
MediaTek's handset chip shipments are expected to reach 100 million units in the third quarter, hitting the company's record, and topping 350 million units in 2009, according to industry...
Thursday 16 July 2009
Intel orders expected to help ASE and SPIL outperform 3Q sales expectations
IC packaging and testing firms Advanced Engineering Semiconductor (ASE) and Siliconware Precision Industries (SPIL) are likely to outperform market watchers' expectation of 10% sequential...
Wednesday 15 July 2009
ASE, SPIL to benefit from Qualcomm Snapdragon business
Qualcomm's new platform Snapdragon is in the process of validation and volume production is scheduled for the end of the third quarter, which will help boost utilization rates of...