Micron is expanding its HBM production capacity in the United States and exploring the possibility of manufacturing the product in Malaysia, which is driven by soaring global demand...

With the intensifying competition in the AI memory chip market, leading memory vendors like SK Hynix, Micron Technology, and Samsung Electronics are gearing up for proxy patent battles...

Order visibility for HBM memory has been extended until the first quarter of 2026, spurred by the AI boom, according to sources at Taiwanese memory makers.

These are the most-read DIGITIMES Asia stories in the week of June 3 – June 7.

Micron Technology has announced the sampling of its next-generation GDDR7 graphics memory, which it says boasts the industry's highest bit density for AI, gaming, and high-performance...

Air Liquide has announced plans to construct a new industrial gas production facility in the US to serve Micron Technology's new fab. Under a long-term contract, the plant will produce...

Nvidia CEO Jensen Huang disclosed that the next-generation Rubin platform will be equipped with 6th-gen high bandwidth memory - HBM4 at...

SK Hynix is swiftly advancing in the High-Bandwidth Memory (HBM) arena, aiming to develop next-generation HBM that incorporates computing, communication, and other advanced functions...

Although the current High-Bandwidth Memory (HBM) market is still dominated by SK Hynix and Samsung Electronics, Micron has recently caught up rapidly. Following its earlier announcement...

The Government of Gujarat, India, has dispatched a delegation to Taiwan for the India-Taiwan Semiconductor Summit, while also seizing the opportunity to glean knowledge from Taiwanese...

High Bandwidth Memory (HBM) is a graphic memory with high bandwidth. Its main function is to support High-Performance Computing (HPC) or high-speed parallel computing with CPU/GPU...

Micron Technology's High-Bandwidth Memory (HBM) sales will climb to several hundred million US dollars in the current fiscal year and then to several billion US dollars in the next...

Samsung Electronics has successfully stacked the next-gen 3D DRAM to 16 layers, twice as many as its competitor Micron.

Micron, which has a DRAM factory in Hiroshima Prefecture, Japan, is reportedly planning to construct a new plant adjacent to the existing Hiroshima factory as early as 2026.

Hanmi Semiconductor's new plant has been operational for just over a month, and the company has started expanding further. They aim to accelerate the production capacity of High-Bandwidth...