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Thursday 16 April 2026
TSMC hints at next-gen LPU bid, stokes speculation that Samsung's Groq order may not last
TSMC Chairman C.C. Wei disclosed at the company's first-quarter 2026 earnings call that the foundry is collaborating with a customer on next-generation LPU development —a remark...
Thursday 16 April 2026
Cadence, Nvidia deepen AI partnership to reshape chip design and robotics
Cadence Design Systems and Nvidia have expanded their partnership to accelerate the use of artificial intelligence (AI) across semiconductor design, robotics, and large-scale AI infrastructure,...
Thursday 16 April 2026
Analysis: Nvidia links RISC-V to NVLink with SiFive investment

Agentic AI is pulling CPUs back to the center of the AI stack, turning them into a renewed battleground for chipmakers. After Arm moved...

Thursday 16 April 2026
Samsung targets May HBM4E samples for Nvidia after validation

Samsung Electronics is aiming to produce its first samples of next-generation high-bandwidth memory (HBM4E) as early as May, with plans...

Wednesday 15 April 2026
Taiwan equipment makers ride advanced packaging and SiPh wave
Nvidia is accelerating the commercial rollout of silicon photonics (SiPh) technology, marked by the launch of its Rubin Ultra platform and the gradual establishment of co-packaged...
Wednesday 15 April 2026
Nscale redirects OpenAI's Stargate Norway capacity to Microsoft
Hyperscaler Nscale has agreed to rent data center capacity to Microsoft at its campus in Narvik, Norway. Located in the Arctic Circle, the site was previously intended for OpenAI as...
Wednesday 15 April 2026
RISC-V gains ground in AI data centers with Nvidia backing SiFive

AI workloads are scaling faster than traditional CPU architectures were ever designed to handle, exposing clear limits in performance...

Wednesday 15 April 2026
SK Hynix may cut Nvidia HBM4 shipments as Rubin ramp reportedly faces delays

SK Hynix is reportedly considering reducing its planned 2026 shipments of high-bandwidth memory (HBM4) to Nvidia by about 20-30%, amid...

Wednesday 15 April 2026
Nvidia unveils 'Ising' AI models to accelerate quantum computing development
Nvidia has introduced a new open family of AI models called Ising, designed to address two of the most persistent engineering bottlenecks in quantum computing: processor calibration...
Wednesday 15 April 2026
Nvidia's RISC-V push shapes cloud AI's three-way architecture race
Nvidia recently joined the Series G funding round of SiFive, a leading RISC-V chip IP provider. Although Nvidia was one among many investors and the round raised about US$400 million,...
Tuesday 14 April 2026
Google and Intel expand CPU partnership, boosting ASIC and startup opportunities
Google recently announced an expanded collaboration with Intel to increase the deployment of Xeon processors in its cloud AI data centers. This move reflects the rapidly growing demand...
Monday 13 April 2026
DIGITIMES Insight: US MATCH Act tightens export noose while Intel swaps debt for control and Nvidia co-opts rivals
The semiconductor industry is undergoing coordinated shifts that could reshape equipment flows, corporate financing, and supplier relationships in the AI era, according to DIGITIMES...
Saturday 11 April 2026
Samsung Electro-Mechanics reportedly strengthens role in Nvidia's Groq 3 LPU supply chain with FC-BGA substrate push
Samsung Electro-Mechanics has reportedly secured a leading position in the supply chain for advanced substrates used in the Groq 3 language processing unit (LPU), a next-generation...
Friday 10 April 2026
CoWoS capacity emerges as AI bottleneck as TSMC’s advanced packaging grows at 80% CAGR
Global advanced packaging capacity is currently in severe shortage. Nvidia has already reserved most of TSMC's leading-edge capacity, particularly its CoWoS packaging technology. According...
Friday 10 April 2026
Anthropic reportedly explores in-house chip design amid rapid revenue growth and evolving AI compute stack
Anthropic is exploring the possibility of designing its own AI chips, though the effort remains at a very early stage, Reuters reported, citing three sources familiar with...