CONNECT WITH US
NEWS TAGGED NVIDIA
Friday 30 October 2026
Nvidia dominates AI robot chips with 69% market share
The rapid development of AI robotics applications is driving a sharp increase in semiconductor computing requirements. According to DIGITIMES Intelligence, Nvidia is set to dominate...
Friday 30 October 2026
Nvidia weighs credit support for Nscale as data center, IPO face pressure
Nvidia is reportedly evaluating billions of dollars in credit support for UK neocloud provider Nscale to help cover power and construction costs for a data center in West Virginia...
Friday 30 October 2026
Jensen Huang calls Megaspeed ties normal amid Washington's spy probe
After The New York Times reported that a female executive at Singapore-based Megaspeed International was under investigation for allegedly conducting espionage activities...
Friday 30 October 2026
Analysis: Oracle backs Cerebras as AI cloud shifts to multi-architecture compute
Oracle will offer cloud services powered by Cerebras' AI computing systems in its cloud data centers starting in 2027, giving the wafer-scale chipmaker another major cloud customer...
Friday 30 October 2026
Anthropic's multi-platform AI strategy pressures Nvidia pricing power
Anthropic's "multi-platform resource pool" strategy, disclosed in its S-1 filing, is sending an important signal to the AI chip industry. The company uses Amazon Trainium, Google tensor...
Friday 30 October 2026
Analysis: Can Kazakhstan really be Europe's AI factory?
Nvidia CEO Jensen Huang's visit to Kazakhstan highlights a widening contest over AI computing capacity, as Europe seeks alternatives to infrastructure concentrated in the US and Asia...
Thursday 29 October 2026
Nvidia under probe by US justice officials over Hugging Face acquisition
The US Department of Justice (DOJ) is reviewing how Nvidia's acquisition of Hugging Face could affect competition in the AI industry, while a years-long antitrust investigation continues...
Thursday 29 October 2026
Nvidia trims HBM4 bandwidth for Rubin platform, sources say
Nvidia is reportedly adjusting the fourth-generation high-bandwidth memory (HBM4) specification for its Vera Rubin NVL72 platform, cutting bandwidth per GPU from the previously announced...
Thursday 29 October 2026
LG Electronics ties AI cooling and robot plans to new plants and a 2030 humanoid target
LG Electronics used its third-quarter earnings call on October 28 to add physical milestones to its two main AI bets. In data center cooling, it named a US production site and new...
Thursday 29 October 2026
Samsung Electro-Mechanics says AI customers are locking up 2027 MLCC and substrate supply
Samsung Electro-Mechanics (SEMCO) told investors on October 28 that long-term agreements are expected to account for more than 60% of its multilayer ceramic capacitor (MLCC) revenue...
Wednesday 28 October 2026
Oracle accelerates AI chip diversification with Cerebras, Google, and SambaNova deals
Oracle has signed partnerships with Cerebras and other chipmakers to host their chips in its cloud infrastructure. The Cerebras deal gives the chipmaker a new large customer to anchor...
Wednesday 28 October 2026
AMD to invest US$1 billion in Meta's stock sale as Helios racks enter testing
AMD is backing one of its largest AI customers with capital and chips. Alongside an update on its hardware work with Meta, the chipmaker said on October 27 that it will invest US$1...
Wednesday 28 October 2026
Google TPUs land Oracle, with OpenAI reportedly next
Google's tensor processing unit (TPU) business has gained one confirmed and one reported major customer within a week, adding pressure on Nvidia, whose graphics processors still dominate...
Wednesday 28 October 2026
Nvidia DSX POD targets AI factories as Microsoft and AWS push modular data centers to the edge
Nvidia's newly unveiled DSX POD promises to accelerate AI data-center deployment from months to weeks, joining earlier modular offerings from Microsoft and Amazon Web Services (AWS)...
Wednesday 28 October 2026
TLB develops SOCAMM3 substrates; Vietnam plant to break ground
South Korean memory module substrate maker TLB has begun developing substrates for SOCAMM3, a next-generation low-power memory module for AI servers, with two major memory customers...