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NEWS TAGGED MEDIATEK
Wednesday 22 April 2026
How MediaTek will supply Marvell's next three generations of TPUs
Recent market reports indicate that Marvell is in discussions with Google regarding the development of application-specific integrated circuit (ASIC) products, including memory processing...
Wednesday 22 April 2026
Flagship smartphone SoCs upgrade to 2nm drives cost surge and brand procurement shifts
Starting in the second half of 2026, all flagship smartphone SoCs will transition to the 2nm process node. While this promises enhanced performance for flagship devices, it also triggers...
Monday 13 April 2026
MediaTek revenue hits record on AI chip demand, TPU orders key
Taiwan-based chip designer MediaTek reported record monthly revenue in March 2026, highlighting how new growth drivers are helping cushion a weakening smartphone market.
Friday 10 April 2026
MediaTek builds an end-to-end challenge to Qualcomm and Broadcom
In recent years, MediaTek has steadily increased its influence in the global Wi-Fi chip market. Its market share gains have been driven not only by continued growth on the consumer...
Wednesday 8 April 2026
Broadcom, Google, and Anthropic alliance faces MediaTek competition
Broadcom recently announced two major partnership developments. The first is with Google on its Tensor Processing Unit (TPU) application-specific integrated circuits (ASICs), with...
Tuesday 7 April 2026
MediaTek, Qualcomm reportedly cut smartphone AP orders with TSMC
Amid soaring memory prices, manufacturers have repeatedly lowered 2026 shipment targets for smartphones, PCs, and other consumer electronics, triggering a ripple effect across the...
Tuesday 7 April 2026
Google's chip revisions raise questions for MediaTek's growth plans

Recent reports suggest that Google has once again made engineering changes to its Tensor Processing Unit, or TPU, pushing the chip's tape-out...

Tuesday 31 March 2026
MediaTek and Airoha deepen telecom open-source platform to challenge Broadcom, Qualcomm in edge AI
Airoha announced on March 30, 2026, that it has expanded the adoption of open-source systems in networking communications, becoming the world's first fiber broadband chip platform...
Tuesday 31 March 2026
Custom chips demand spike draws Taiwan firms into ASIC arena
While the barriers to entry in cloud AI ASICs remain out of reach for many chip designers, demand for specialized chips at the edge is rising sharply. Across a widening range of applications,...
Thursday 26 March 2026
MediaTek advances Taiwanese language AI amid linguistic and security challenges
MediaTek highlighted at AI EXPO Taiwan 2026 how language-specific challenges complicate the deployment of AI globally, as Taiwanese tonal variety, mixed writing systems, and local...
Tuesday 24 March 2026
MediaTek's Airoha takes on US giants in optical comms DSP chip arena
The expansion of AI data centers is creating new business opportunities that are opening the door for upstarts to challenge industry leaders. A prime example is the four-level pulse...
Sunday 22 March 2026
MediaTek, Microsoft Research crack AOC power barrier with Micro LED, 50% reduction

A joint R&D team, including MediaTek, Microsoft Research, and other suppliers, has developed a next-generation active optical cable...

Friday 20 March 2026
MediaTek on cruise control as chipmakers scramble for next-gen silicon photonics standards
Nvidia GTC 2026 and the Optical Fiber Communication Conference (OFC) have underscored the growing importance of optical communication in cloud AI, with chipmakers playing an increasingly...
Wednesday 18 March 2026
Taiwan launches 6G industry forum
The Taiwan Association of Information and Communication Standards (TAICS) established the 6G Industry Forum (6GIF) on March 17, a platform for accelerating 6G technology and product...
Wednesday 18 March 2026
Apple adopts MediaTek Wi-Fi chip for MacBook Neo to save costs, say sources
Apple's recently launched affordable MacBook Neo has been found to use MediaTek's Wi-Fi and Bluetooth chips instead of Broadcom or Apple's own N1 chip, according to teardown reports...