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Monday 23 March 2026
Commentary: CPO mass production put to test as photonic integration faces challenges
Driven by massive demand from cloud AI, silicon photonics continues to gain momentum. At the Optical Fiber Communication Conference (OFC 2026), industry players engaged in in-depth...
Monday 23 March 2026
Ventec eyes double-digit growth in 2026 amid product price hikes and niche material expansion
Niche copper-clad laminate (CCL) manufacturer Ventec expects to achieve double-digit revenue growth in 2026, driven by ongoing product price increases and strategic expansion into...
Monday 23 March 2026
Konica Minolta to expand AI chip inspection optics capacity 2.6x by 2027

Japanese optical component and office equipment maker Konica Minolta said on March 18 it will scale up its optical components business for...

Sunday 22 March 2026
Chunghwa Precision Test breaks ground on new Taiwan plant to meet AI chip demand
Chunghwa Telecom-owned probe card manufacturer Chunghwa Precision Test (CHPT) broke ground on a new plant on March 20 at the Pingzhen Industrial Park in Taoyuan, signaling an aggressive...
Saturday 21 March 2026
SK Hynix targets autonomous fabs by 2030 to tackle AI-driven manufacturing challenges
SK Hynix is targeting the development of autonomous semiconductor fabrication facilities by 2030 as it seeks to address rising AI-driven demand and increasing manufacturing complexity,...
Saturday 21 March 2026
MA-tek secures top 3 global SiPh orders, eyes US-Japan growth in 2026
With silicon photonics (SiPh) demand surging, MA-tek chairwoman Yong-Fen Hsieh announced the company has secured major orders from the world's three largest customers, driving revenue...
Friday 20 March 2026
Global top-3 memory maker status, 1Q 2026

Introduction

Friday 20 March 2026
Samsung reportedly secures OpenAI HBM4 supply deal, shifts foundry capacity
Samsung Electronics is reportedly set to exclusively supply sixth-generation high-bandwidth memory (HBM4) to OpenAI while reallocating more than half of its advanced foundry capacity...
Friday 20 March 2026
Research Insight: AI reshapes Taiwan's PCB industry around high-end capacity and materials
DIGITIMES observes that as demand surges for AI servers, high-speed switches, optical communication modules, and edge AI devices, Taiwan's PCB industry is undergoing a structural...
Friday 20 March 2026
Memory price surge drives Transcend's 15x profit growth in January 2026
Memory module maker Transcend reported a remarkable profit increase for January 2026, with net income reaching NT$2.786 billion (approx. US$87.2 million), up 1578% year-over-year....
Friday 20 March 2026
MediaTek on cruise control as chipmakers scramble for next-gen silicon photonics standards
Nvidia GTC 2026 and the Optical Fiber Communication Conference (OFC) have underscored the growing importance of optical communication in cloud AI, with chipmakers playing an increasingly...
Friday 20 March 2026
As NAND makers move on, MLC memory nears the end of the line

As global NAND flash makers shift toward higher-layer 3D architectures, legacy MLC NAND is slipping into a severe supply-demand imbalance...

Friday 20 March 2026
Nvidia Vera Rubin servers to drive liquid cooling demand
Nvidia has revealed more details about its next-generation Vera Rubin (VR) servers at Nvidia GTC 2026, confirming a full transition to liquid cooling architecture. Thermal module makers...
Friday 20 March 2026
Analysis: Alibaba and Baidu raise AI pricing as token-based model reshapes cloud economics
Alibaba and Baidu have raised prices for AI computing services, reflecting a broader shift in how cloud providers monetize AI as demand for tokenized workloads accelerates.
Friday 20 March 2026
Alibaba outlines US$100 billion AI roadmap as cloud growth accelerates
Alibaba Group Holding set out an expansive artificial intelligence strategy targeting more than US$100 billion in combined cloud and AI revenue within five years, as strong demand...