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Saturday 16 May 2026
China's memory push accelerates as YMTC and CXMT expand DRAM ambitions
China's memory semiconductor industry is entering a new phase of expansion as leading domestic players ramp up investments in both NAND flash and DRAM technologies, amid an AI-driven...
Friday 15 May 2026
China keeps tight InP export controls despite Trump-Xi talks
As the US and China continue to clash over geopolitics and critical materials supply, industry sources say China's restrictions on indium phosphide (InP) substrates for optical communications...
Friday 15 May 2026
Foxconn moves from validation to commercialization with AI servers, robots, EVs and LEO satellites
Foxconn used its first quarter of 2026 earnings call to signal that its long-term "3+3+3" strategy is transitioning from technical validation into commercialization, highlighting growth...
Friday 15 May 2026
Hua Hong Semiconductor strategy focuses on AI demand and specialty tech expansion
Hua Hong Semiconductor is positioning itself to capitalize on the accelerating transformation of the global semiconductor industry, driven primarily by the "unmistakably positive impact...
Friday 15 May 2026
InP compound semiconductors break AI power and bandwidth barriers
Indium phosphide (InP) and other compound semiconductors are taking on a bigger role as demand rises for highly efficient light emission and ultra-high-frequency transmission. Their...
Friday 15 May 2026
Etron chair warns of US-South Korea alliance threatening Taiwan's chip industry
Memory industry profits have surged, and Samsung Electronics recently posted earnings that exceeded TSMC's revenue for the first quarter of 2026, underscoring memory's rise as a strategic...
Friday 15 May 2026
South Korea denies plan to share semiconductor tax windfall with citizens
A political debate in South Korea over how to manage windfall tax revenues from the country's semiconductor boom has intensified after remarks by a senior presidential aide sparked...
Thursday 14 May 2026
Samsung reportedly speeds up 3D NAND, packaging, and substrate plans
Samsung Electronics is reportedly reviving delayed semiconductor initiatives across next-generation NAND flash, compound semiconductors, advanced packaging, and substrates —...
Thursday 14 May 2026
MediaTek courts Intel as Google pushes for alternatives to CoWoS
MediaTek's decision to pursue advanced packaging partnerships with both TSMC's CoWoS ecosystem and Intel's EMIB platform has become one of the semiconductor industry's most closely...
Thursday 14 May 2026
China's semiconductor godfather warns against 2nm fixation
While the global semiconductor industry remains fixated on 3nm, 2nm, and the AI GPU arms race, SMIC founder and "China's semiconductor godfather" Zhang Rujing is pushing a sharply...
Wednesday 13 May 2026
Hanwha Semitech to supply FO-PLP equipment for SpaceX-linked chip production
South Korean semiconductor equipment maker Hanwha Semitech is reportedly preparing to supply fan-out panel-level packaging (FO-PLP) equipment for advanced chip packaging in the second...
Wednesday 13 May 2026
Taiwan's semiconductor supply chain posts broadly positive April; AI demand clearly visible across ecosystem
Of the 238 Taiwan-listed semiconductor and related companies tracked by Digitimes, 73% (173 companies) posted positive year-on-year revenue growth in April 2026, and...
Wednesday 13 May 2026
Taiwan machinery exports rise for 15th month on AI and semiconductor demand
Taiwan's machinery exports expanded for the 15th consecutive month in April 2026, as sustained demand for AI infrastructure and semiconductors lifted shipments of electronic equipment...
Wednesday 13 May 2026
Singapore pushes ASEAN semiconductor alliance as AI reshapes global supply chains

At a time when the global semiconductor industry is undergoing a historic restructuring, the Singapore Semiconductor Industry Association...

Tuesday 12 May 2026
TSMC CoWoS shortage drives SK Hynix-Intel 2.5D push
TSMC's tight CoWoS supply is reportedly pushing SK Hynix to work with Intel on advanced packaging, as the industry looks to diversify the 2.5D packaging supply chain for AI acceler...