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Wednesday 14 August 2024
PCB firm Zhen Ding sees new Thai facility development progress
Zhen Ding Technology, a Taiwan-based flexible PCB and IC substrate supplier, has seen the development of its new plant in Thailand progress more smoothly than anticipated. The plant...
Tuesday 13 August 2024
Samsung reportedly investing in in-house chip development to compete in XR market
Samsung Electronics is developing high-performance semiconductors for next-generation Extended Reality (XR) devices, aiming to compete with Apple's Vision Pro, which uses in-house...
Tuesday 13 August 2024
SK Hynix to face challenges for US fab despite subsidies
SK Hynix is anticipated to expedite the development of its high-bandwidth memory (HBM) manufacturing and R&D fab in Indiana, with government incentives under the US CHIPS and...
Monday 12 August 2024
SDC reportedly signs contract with Microsoft
Samsung Display (SDC) is reportedly collaborating with Microsoft to develop and supply OLED on Silicon (OLEDoS) for the next generation of Mixed Reality (MR) devices.
Monday 12 August 2024
Government support fuels Malaysia's new Infineon Kulim plant
Infineon inaugurated its new 8-inch SiC semiconductor plant in Kulim, Malaysia, on August 8.
Monday 12 August 2024
Weekly news roundup: Intel telecommunications faces cost cuts; Indian opto-semiconductor maker makes acquisition
These are the most-read DIGITIMES Asia stories in the week of August 5 – August 9.
Monday 12 August 2024
Intel unveils discrete GPU for automotive AI
Intel recently introduced its first discrete graphics processing unit (dGPU), known as the Intel Arc graphics for automotive. The product is set to be commercially deployed in vehicles...
Monday 12 August 2024
Companies weigh building AI models vs. using API solutions
Companies are currently navigating the challenge of integrating generative AI, weighing whether to build their own models or tap into external resources.
Monday 12 August 2024
Hycon Tech's SiS acquisition fuels advanced chip development amid market shifts
IC design firm Silicon Integrated Systems (SiS)'s stock exchange agreement with Hycon Technology has drawn significant market attention. Hycon stated that post-merger, it will become...
Friday 9 August 2024
SiS and Hycon merge to drive major product transformation
Taiwan-based IC design firm Silicon Integrated Systems Corp (SiS) announced it will acquire MCU manufacturer Hycon Technology through a share swap.
Thursday 8 August 2024
Potential US ban on Chinese vehicle tech to breed longer-term effects on tech rift
The US is reportedly preparing to impose a ban on vehicle technology that raises cybersecurity concerns. While this move may not immediately impact automakers, it could further widen...
Thursday 8 August 2024
Innodisk teams up with Advantech to expand AI visual application
Industrial control memory module manufacturer Innodisk is partnering with Advantech, taking its customizable MIPI series camera modules and combining them with Advantech's Intel x86...
Thursday 8 August 2024
Supermicro promotes liquid cooling servers
The development of liquid cooling continues unabated, despite reports of Nvidia delaying GB200 shipments. Supermicro co-founder and CEO Charles Liang notes that clients have continued...
Thursday 8 August 2024
China rushing into chiplet and HBM fab tool development
China-based semiconductor equipment manufacturers have expedited their domestic development efforts, foraying into the chiplet and HBM memory sectors, according to industry sources...
Wednesday 7 August 2024
TSMC demand and Kumamoto lab boost MA-tek's July 2024 revenue to record high
Driven by increasing AI demand and significant growth in its Japan-based laboratory operations, semiconductor inspection giant MA-tek reported record-breaking monthly revenue of NTD...