Samsung Group and Hyundai are deepening their strategic partnership, exploring opportunities in robotics, energy and physical AI alongside existing cooperation in automotive semiconductors,...
Huawei is preparing to introduce a new smartphone sub-brand, OSTA, at a product launch event on November 20, potentially expanding its portfolio with a wider-format candybar smartphone...
Samsung Electronics said on November 12 it had moved up the planned opening of its new high-bandwidth memory (HBM) packaging plant in South Korea by one year to June 2028 to meet rising...
The award ceremony for the fourth K. T. Li Award was held in Taipei on November 10, with this year's awards presented by former President Ing-wen Tsai to Kinpo-Compal Group president...
Charles Kau, chairman of IEMC, said TSMC "cannot make 3D DRAM," dismissing reports that the foundry is evaluating entry into the next-generation memory market at Nvidia's request....
Smaller electronics manufacturers are relying on the spot market for memory as major customers lock in future supply through long-term agreements, according to independent electronic...
Malaysia's Prime Minister Anwar Ibrahim's comments supporting the one-China principle and the use of force to unify Taiwan continue to weigh on Taiwan-Malaysia ties nearly three months...
Some server buyers are asking for barebones systems and planning to purchase memory separately as component shortages complicate deliveries, according to independent electronic components...
Hiwin Technologies Corp. expects demand from AI, data centers, and semiconductor equipment to keep orders for precision motion components strong into mid-2027, chairman Eddie Cho said...
Quanta Computer vice chairman C.C. Leung said on November 10, following the K.T. Li Award ceremony, that the US must continue expanding its investment in artificial intelligence (AI)...
Qisda is increasing its investment in AI, with chairman Peter Chen saying a short-term slowdown in data-center construction would not derail the long-term AI trend and could ease component...
Young Liu, chairman of Hon Hai Technology Group (Foxconn), repeatedly highlighted the company's strength in vertical integration at Hon Hai Tech Day 2026 (HHTD26), underscoring progress...
Wistron ITS posted strong results in the third quarter of 2026, driven by growth in the semiconductor, gaming, and entertainment industries. According to chairman and CEO Ching Hsiao,...
Zhu Yiming, chairman of ChangXin Memory Technologies (CXMT), reportedly participated in Chinese AI startup DeepSeek's second funding round, drawing attention to his semiconductor investment...
Winbond Electronics chairman Arthur Chiao said the AI data center buildout planned by major cloud service providers (CSPs) for 2027 and 2028 is largely secured, with funding, land,...
