News tagged East Asia at DIGITIMES

NEWS TAGGED EAST ASIA

Saturday 3 January 2026

Analysis: Japan targets advanced packaging to crack TSMC's manufacturing edge

Japanese semiconductor firms are pivoting toward advanced packaging and alternative lithography as TSMC extends its scale advantage in artificial intelligence chips. TSMC's 3nm and...

Friday 2 January 2026

Global auto market faces turning point in 2026 as competition in China intensifies

The global automotive market reached a critical turning point in 2025 amid unprecedented pressures from tariffs, policies, and inflation, triggering preemptive buying before expected...

Friday 2 January 2026

Baidu's AI chip unit Kunlunxin confidentially files for Hong Kong IPO

Baidu is moving forward with plans to spin off its AI chip unit, Kunlunxin, and list it in Hong Kong, highlighting the company's push for semiconductor self-sufficiency. On January...

Friday 2 January 2026

CXMT logs first annual profit on DRAM price rebound

ChangXin Memory Technologies (CXMT) returned to profitability in 2025, recording its first full year of net income after a rebound in...

Friday 2 January 2026

US approval of TSMC equipment exports to China reflects strategy shift

Following reports that the US government had granted annual export licenses to South Korea's Samsung Electronics and SK Hynix, the US Department of Commerce (DOC) has also approved...

Friday 2 January 2026

China's CXMT moves toward IPO with global DRAM share nearing 4%

China's leading DRAM producer, ChangXin Memory Technologies (CXMT), has entered the initial public offering phase as it targets a rapid increase in global market share, aiming to...

Friday 2 January 2026

Samsung reportedly seals land deal, paving way for Yongin semiconductor complex

Samsung Electronics has taken a key step toward building a massive semiconductor manufacturing complex in Yongin after finalizing a land purchase for a national industrial park, moving...

Friday 2 January 2026

Samsung aims for 2026 HBM4 mass production after customer validation

Samsung Electronics plans to begin mass production of its sixth-generation high-bandwidth memory chips in 2026, citing positive feedback from customers as the South Korean tech giant...

Friday 2 January 2026

South Korea's semiconductor bill risks weakening competitiveness as rivals roll out cash subsidies

South Korea's ruling and opposition parties have reached a preliminary consensus on the Semiconductor Special Act, though its passage may be delayed until 2026, and the law faces...

Friday 2 January 2026

China demand pushes Nvidia to seek more H200 capacity from TSMC

Nvidia is in talks with TSMC to expand production of its H200 artificial intelligence chips as Chinese technology companies move to secure large orders for 2026, according to Reuters...

Friday 2 January 2026

China sees 2025 chip IPO surge as domestic AI and tech ambitions accelerate

Chinese semiconductor companies are returning to the initial public offering (IPO, including additional and rights offering) market in force, raising funds that are critical for the...

Friday 2 January 2026

Samsung raises 2025 bonuses for DS division amid memory boom

Samsung Electronics' Device Solutions (DS) division is set for a strong 2025, driven by robust performance in general-purpose DRAM and high-bandwidth memory (HBM).

Friday 2 January 2026

Chinese AI firms ramp up expansion in Singapore amid fierce local competition

Facing stiff competition in the domestic market, Chinese technology companies are accelerating their push into international markets, with artificial intelligence (AI) firms spearheading...

Thursday 1 January 2026

China capacity expansion and weakening end-market demand prompt cost reductions for 28nm process

The 28-nanometer process has become the most popular node among mature processes. It boasts the highest utilization rates and the strongest price support. However, market conditions...

Thursday 1 January 2026

Samsung reportedly explores side-by-side chip packaging for next-gen Exynos

Samsung Electronics is reportedly developing a new mobile chip packaging method aimed at improving thermal efficiency in its Exynos processors,...

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Jan 6, 16:39

MSI Unveils Full Lineup of AI Products at CES 2026

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