News tagged Micron at DIGITIMES

NEWS TAGGED MICRON

Wednesday 15 July 2026

CXMT's US$4.3B IPO powers China's HBM challenge to global memory giants

CXMT is preparing China's largest chip-sector IPO of 2026, seeking up to US$4.3 billion to expand DRAM and HBM capacity, deepen vertical...

Monday 13 July 2026

Huawei reportedly backs 12-inch DRAM fab to reduce memory dependence

Huawei is reportedly partnering with Chinese DRAM maker Shenzhen Shengweixu Technology (SwaySure) and the Chinese government to build...

Friday 10 July 2026

Analysis: Samsung, SK Hynix, and Micron's diverging approach to HBM4 base dies

Samsung Electronics, SK Hynix and Micron Technology are taking different manufacturing paths for the logic base die in HBM4, opening...

Friday 10 July 2026

Micron's US$250 billion memory push sharpens three-way race with Korean and Chinese rivals

Micron Technology's decision to lift its planned US investment to more than US$ 250 billion through 2035, unveiled July 9 alongside the first concrete pour at its Clay, New York, site,...

Friday 10 July 2026

GlobalWafers-Micron deal pushes US semiconductor localization beyond chip fabs

GlobalWafers and Micron have signed a 10-year supply agreement, alongside US$500 million in strategic financial support, in a move that underscores how artificial intelligence (AI),...

Thursday 9 July 2026

Micron commits $250 billion to US chip buildout as New York fab breaks ground ahead of schedule

Micron Technology said July 9 it is raising its planned US fab and technology investment to more than $250 billion through 2035, citing surging demand for memory driven by AI. The...

Thursday 9 July 2026

SK Hynix supplier talks show AI memory boom shifting pricing power

The AI data center boom is reshaping the memory supply chain, giving Samsung Electronics, SK Hynix, and Micron greater pricing power...

Wednesday 8 July 2026

Samsung's HBM4 comeback hinges on one chip-level advantage

Samsung Electronics is using HBM4 to test whether its memory, logic, foundry, and advanced packaging businesses can finally work as...

Tuesday 7 July 2026

Micron, Ford sign long-term memory supply agreement

Micron Technology and Ford Motor Company have entered into a long-term supply agreement to strengthen access to automotive memory and storage products. The deal underscores how chip...

Monday 6 July 2026

Samsung, SK Hynix and Micron face HBM4 race as custom chip demand grows

The global high-bandwidth memory market is expected to pivot from HBM3E to HBM4 in the second half of 2026, setting up a sharper contest...

Monday 6 July 2026

Micron breaks ground on Hiroshima expansion to boost AI memory chip production

Micron Technology has begun construction on an expansion of its existing semiconductor plant in Higashi-Hiroshima, western Japan, as part of a JPY1.5 trillion (approx. US$9.3 billion)...

Saturday 4 July 2026

Commentary: Korea's KRW800tn chip bet risks US fab pressure while Apple profits from memory shock

South Korean President Lee Jae-myung, Samsung Electronics, and SK Hynix have announced the country's largest-ever semiconductor expansion plan, while soaring memory prices have opened...

Friday 3 July 2026

Samsung's HBM4E yield tops 70%, sharpening AI memory race with SK Hynix and Micron

Samsung Electronics is moving closer to commercialising HBM4E, its seventh-generation high-bandwidth memory (HBM), after internal testing showed reliability yields above 70%, strengthening...

Thursday 2 July 2026

Analysis: How long can memory's AI-driven boom last?

The global memory market is enjoying one of its most profitable cycles in years. AI data center demand has driven DRAM and NAND prices sharply higher, and the three companies that...

Thursday 2 July 2026

Micron and GM strike long-term memory supply deal for vehicles

Micron Technology and General Motors (GM) have signed a strategic customer agreement to secure a long-term supply of memory and storage products for vehicle production. The deal underscores...

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LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE

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