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Thursday 29 October 2026
Nvidia trims HBM4 bandwidth for Rubin platform, sources say
Nvidia is reportedly adjusting the fourth-generation high-bandwidth memory (HBM4) specification for its Vera Rubin NVL72 platform, cutting bandwidth per GPU from the previously announced...
Thursday 29 October 2026
Phison wins Micron supplier awards for third straight year
Taiwan-based Phison Electronics received two awards at Micron Supplier Day 2026, marking the third consecutive year the company has earned recognition from the US memory chipmaker.
Wednesday 28 October 2026
SK Hynix bets on EUV to extend 6F-squared DRAM as CXMT pushes 4F-squared
SK Hynix plans to extend the life of its existing 6F-squared DRAM cell architecture through extreme ultraviolet (EUV) lithography and process improvements, keeping 4F-squared and three-dimensional...
Wednesday 28 October 2026
Micron recruits in South Korea for Taiwan roles as Taoyuan strike dispute persists
Micron Technology is heading to South Korea to recruit engineers for its Taiwan operations, with interviews scheduled in Seoul in late November, as a bonus dispute at its Taoyuan plant...
Friday 23 October 2026
Taiwan's inaugural semiconductor strike pauses as nearly 70% of Micron Taoyuan Union rejects new bonus offer
Taiwan's first-ever strike in the semiconductor industry has temporarily drawn to a close. A 24-hour warning strike spearheaded by Micron Technology's Taoyuan union concluded on the...
Thursday 22 October 2026
Micron overhauls pay in Taiwan as unions push for profit sharing
Micron is overhauling how it pays employees, promising quarterly profit-sharing bonuses and better pay and benefits for its Taiwan staff. The changes follow a labor dispute with the...
Thursday 22 October 2026
BOS, LG, and HANA Micron team up on Korean automotive chiplets
BOS Semiconductors is partnering with LG Electronics and HANA Micron to develop and commercialize chiplet-based automotive semiconductors in South Korea, connecting domestic AI chip...
Thursday 22 October 2026
Micron skips 4F² for 3D DRAM as CXMT pushes ahead
Micron does not plan to commercialize 4F² DRAM even as Chinese rival ChangXin Memory Technologies (CXMT) advances the technology, saying the architecture offers limited benefits...
Thursday 22 October 2026
Samsung's Nvidia HBM bid raises four strategic concerns
Samsung Electronics is reportedly turning to TSMC's 3nm process to produce base dies for Nvidia's custom high-bandwidth memory (NVHBM), abandoning its long-standing turnkey integration...
Wednesday 21 October 2026
Micron reaches deal with Taiwan union to introduce quarterly profit bonuses in FY27
Micron Technology's labor dispute in Taiwan appears set for resolution after its Taichung union signed a labor-management agreement with the company and withdrew from the mediation...
Wednesday 21 October 2026
Micron's Taichung union deal eases Taiwan DRAM strike risk; Taoyuan dispute remains unresolved
With a strike by Micron Taiwan employees looming, Micron Technology said Micron Memory Taiwan and the Taichung chapter of the Taiwan Micron Memory Union had reached agreement on several...
Wednesday 21 October 2026
Micron faces potential Taiwan strike, union cites Samsung, SK Hynix profit-sharing benchmark
Micron Technology's Taoyuan union has announced a one-day warning strike for October 22, coinciding with a second round of labour mediation between the company and its Taichung union...
Tuesday 20 October 2026
DIGITIMES Insights: Renewable energy bottlenecks in South Korea, Taiwan, Singapore slow memory chipmakers' RE100 progress
The world's three largest memory manufacturers—Samsung Electronics, SK Hynix, and Micron Technology—along with Taiwan-based Nanya Technology, Winbond Electronics, and Macronix...
Monday 19 October 2026
Micron develops robot memory as Samsung, SK Hynix target physical AI
Micron is developing a memory architecture for humanoid robots, joining Samsung Electronics and SK Hynix in efforts to serve AI systems that must process sensor data while operating...
Monday 19 October 2026
Weekly news roundup: Tata's Dholera fab faces test; how Intel's CEO helped reshape its comeback
This week's coverage (October 12 to October 18, 2026) highlights semiconductor capacity, AI infrastructure, and the commercialization challenges behind ambitious technology strategies...