The next technologies tasked with breaking through the bottleneck of Moore's Law will be silicon photonics (SiPh) and co-packaged optics (CPO). Additionally, TSMC has resumed its...
As advanced packaging technologies and large-size integrated substrate solutions become key development areas for technology firms, glass substrate technology has emerged as a focal...
China-based display solutions supplier BOE Technology has unveiled a roadmap for diversification into making glass substrates for semiconductor packaging.
Printed circuit board (PCB) and IC substrate equipment specialist Group Up Industrial (GP) has stepped up the development of its glass substrate offering, eyeing robust demand for...
Glass Core Substrate (GCS) is becoming a trend that major players in the semiconductor supply chain are avidly pursuing. LG Innotek is reportedly contacting material, components,...
Glass substrates are recognized as critical materials for next-generation advanced semiconductor packaging technologies needed to support the explosive growth of AI chips.
Glass substrate prices are expected to rise in the third quarter of 2024, reflecting the depreciation of the Japanese yen, the tight supply-demand balance, and profits made by some...
Intel has announced the industry's first Glass Core Substrate (GCS) technology for next-generation advanced packaging, which has once again attracted market discussion due to the...
Absolics, an affiliate of South Korean chemical material firm SKC and invested by Applied Materials, signed a Preliminary Memorandum of Terms (PMT) with the US Department of Commerce...
Intel has stepped up orders with several equipment and material suppliers for its next-generation advanced packaging based on glass substrate technology, which is expected to go into...
Samsung Electro-Mechanics (Semco) is reportedly expediting the development of its semiconductor packaging-use Glass Core Substrate (GCS) business by advancing the construction of...
Subsidiaries of the Samsung Group will collaborate to invest in the research and development of Glass Core Substrates (GCS) to expedite their commercialization, aiming to rival Intel,...
As global chipmaking leaders like Intel are optimistic about introducing glass substrates for advanced IC packaging, Japan-based PCB suppliers are capitalizing on the emerging tech...
Demand for foldable smartphones continues to surge as companies like Samsung Electronics, Huawei, and Oppo release new products, significantly boosting market sales and leading to...
