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Friday 27 March 2026
SK Hynix CEO expected to meet Microsoft executive on memory supply

SK Hynix CEO Kwak Noh-jung is expected to meet Scott Guthrie, executive vice president of Cloud and AI at Microsoft, in Seoul this week...

Friday 27 March 2026
SK Hynix targets KRW100 trillion net cash as AI demand surges, eyes US listing

SK Hynix plans to build more than KRW100 trillion (approx. US$66 billion) in net cash to support long-term investment in artificial intelligence...

Friday 27 March 2026
South Korea's M.AX Alliance warns against funding China's robotics
Facing rapid advances in automation and AI from China's manufacturing sector, South Korea is accelerating its manufacturing AI transformation (AX) through the government-led Manufacturing...
Friday 27 March 2026
SK Hynix keeps HBM shipments steady, targets HBM4E sample this year

SK Hynix expects stable growth in its high-bandwidth memory (HBM) business this year and plans to keep shipments in line with initial...

Friday 27 March 2026
Samsung and SK Hynix expand microscope procurement to boost HBM yield
As AI compute demand surges, the rising need for high-bandwidth memory (HBM) testing and failure analysis is reshaping semiconductor inspection equipment markets, affecting chipmakers,...
Thursday 26 March 2026
South Korea freezes 2Q26 electricity rates, amplifying stress on pricing mechanism and future bills
South Korea will keep electricity rates unchanged for the second quarter of 2026 amid geopolitical tensions in the Middle East, which are pushing global energy prices higher, a decision...
Thursday 26 March 2026
Samsung and SK Hynix boost China factory investments in 2025 amid memory demand surge
Samsung Electronics and SK Hynix are significantly increasing capital expenditures at their factories in China to expand chip supply and enhance profitability. According to Seoul...
Thursday 26 March 2026
SK Hynix reportedly weighing TSMC 3nm for HBM4E logic die
SK Hynix is actively evaluating whether to adopt TSMC's 3nm process for the logic die of its seventh-generation high-bandwidth memory (HBM4E), aiming to close Samsung Electronics'...
Wednesday 25 March 2026
China-South Korea panel war escalates: USPTO rejects Tianma patent challenge
The US Patent and Trademark Office has rejected an attempt by Tianma Microelectronics to challenge a patent held by LG Display, citing concerns that the Chinese company may be under...
Wednesday 25 March 2026
Samsung reportedly set to begin GaN foundry production, prepare SiC samples
Samsung Electronics is reportedly set to begin mass production at its gallium nitride (GaN) power semiconductor foundry line as early as the second quarter, while also preparing silicon...
Tuesday 24 March 2026
Hanwha Semitech's SK Hynix TCB deal draws scrutiny over KRW100 billion guarantee
Hanwha Semitech's supply of thermal compression bonding (TCB) equipment for high-bandwidth memory (HBM) to SK Hynix is drawing scrutiny after the South Korean equipment maker maintained...
Tuesday 24 March 2026
SK Hynix reportedly advances M15X ramp, opens second cleanroom ahead of schedule

SK Hynix has brought forward the ramp-up of its M15X DRAM facility in Cheongju, opening a second cleanroom and beginning equipment move-in...

Tuesday 24 March 2026
Trump administration's 'Pax Silica' fund to strengthen global semiconductor and AI supply chains
The Trump administration set up a US$250 million fund intended to grow out of its "Pax Silica" initiative launched in December 2025, aimed at supporting global supply chains for semiconductors,...
Monday 23 March 2026
Samsung reportedly in talks with Google, Microsoft on long-term memory supply agreements

Samsung Electronics is reportedly in discussions with Google and Microsoft to establish long-term memory semiconductor supply agreements,...

Monday 23 March 2026
Samsung chairman joins Beijing forum as China seeks foreign chip investment

Samsung Electronics chairman Lee Jae-yong is attending the China Development Forum (CDF) in Beijing on March 22-23 and is expected to...