Synopsys has announced a collaboration with TSMC to develop a broad portfolio of Synopsys DesignWare Interface and Foundation IP on the TSMC N4P process. The collaboration enables...

TSMC is on track to move N3 (namely 3nm process) technology to volume production in the second half of 2022, and plans to roll out an enhanced version of the process dubbed N3E with...

Samsung Electronics is unlikely to move its 3nm gate-all-around (GAA) FET technology to volume production until 2023, which may put it at a disadvantage in the race for cutting-edge...

TSMC is on track to move its 3nm process technology to volume production in the second half of 2022 for Apple's devices, either iPhones or Mac computers, according to industry sour...

TSMC is expected to grab major sub-7nm chip orders from Qualcomm and Nvidia in 2022, according to industry sources.

TSMC is set to move N4 (namely 4nm process) to risk production in the third quarter of 2021, while its N3 technology development is on track with volume production scheduled for second-half...

Applied Materials has unveiled a new way to engineer the wiring of advanced logic chips that enables scaling to the 3nm node and beyond.

TSMC has already struck a deal with Intel under which the pure-play foundry will use 3nm process technology to manufacture the US vendor's core CPU products, with volume production...

TSMC and Samsung Electronics have both encountered different but critical bottlenecks in the development of their respective 3nm process technologies, according to industry sources...

TSMC plans to launch an enhanced version of 3nm process technology in 2023, with Apple being the initial customer adopting the process, according to industry sources.

TSMC has held a topping-out ceremony for a new 3nm fab at its manufacturing base at the Southern Taiwan Science Park (STSP), paving the way for the new facility to kick off commercial...

TSMC is on track to enter 3nm chip production with monthly output set to reach 55,000 wafers in the second half of 2022, according to sources familiar with the matter. The 3nm process...

Ansys has achieved certification of its advanced semiconductor design solution for TSMC's CoWoS with silicon interposer (CoWoS-S) and InFO with RDL interconnect (InFO-R) advanced...

TSMC has been engaged in the installation of 3nm process fabrication lines and related facilities, and is keeping the progress on track, according to the pure-play foundry.

TSMC has kicked off its 2nm process R&D, and is progressing in research and exploratory studies for nodes beyond 2nm, the foundry has disclosed in its annual report to sharehol...