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    China chip execs shakeup:Cambricon ex-CTO raises claim to CNY27.832 billion
    6h 0min ago
    Prospects of Chinese automakers building US plants, offers potential supply chain opportunities
    6h 0min ago
    China's AI chip-server champions unite under one chair after scrapped merger
    6h 0min ago
    Micron expands global fabs and calls on Taiwanese suppliers to go overseas
    6h 0min ago
    U.S.-China truce extension lifts 4Q freight rates and tightens capacity
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    NEWS TAGGED OPINION
    Thursday 1 October 2026
    Analysis: China's AI data center buildout vaults to No. 2 as Big Tech capex races toward US$100 billion

    China's rapid expansion of AI applications is driving a fresh wave of data center construction. SemiAnalysis estimates that the country has already...

    Thursday 1 October 2026
    Focus: The hidden price of Nvidia's AI agent security play
    Nvidia's new AI agent security platform puts hardware at the centre of agent control, but it also forces enterprises to weigh stronger protection against higher infrastructure costs...
    Thursday 1 October 2026
    DIGITIMES Insight: AI scaling is moving from chip shrinkage to system integration
    TSMC said the next phase of AI performance growth will depend less on shrinking a single chip and more on combining multiple chips, memory, and advanced packaging inside larger systems...
    Thursday 1 October 2026
    DIGITIMES Insight: Agentic AI shifts inference bottleneck to token control and task quality
    DIGITIMES Intelligence observes that AI applications are moving through a clear progression: from early classification AI focused on feature recognition, to generative AI capable of...
    Wednesday 30 September 2026
    DIGITIMES Insight: AI is emerging as the new growth anchor in the mobile communications industry
    South Korea's leading telecommunications operator, SK Telecom (SKT), recently established SK Hyper and SK Horizon in quick succession. The moves mark a pivotal shift for telecommunications...
    Wednesday 30 September 2026
    Interview: iFLYTEK Medical sees clinical integration as key to healthcare AI expansion in South Korea
    Xunfei Healthcare (iFLYTEK Medical), the healthcare AI arm of China's iFlytek, is using its Spark Medical Large Model to support diagnosis and medical record generation while tackling...
    Wednesday 30 September 2026
    Column: Memory and logic collide as AI shifts the balance
    As HBM approaches half the cost of a GPU-HBM CoWoS package, can memory still be viewed as merely a passive component of AI computing? The answer goes back to the "memory wall," a challenge...
    Wednesday 30 September 2026
    Commentary: What risks does China's DRAM capacity face amid tightening market?
    China's continued expansion of DRAM capacity has raised a key question for the global memory market: will supply and demand flip?
    Wednesday 30 September 2026
    Commentary: Garmin returns to OLED, putting Micro LED on notice
    Garmin's decision to offer OLED options but no Micro LED version in its new flagship smartwatches, the fenix 9 and fenix 9 Pro, has revived debate over whether the emerging display...
    Tuesday 29 September 2026
    Column: Why Micron's US$250M venture fund is about more than HBM margins—Taiwan has a stake in it
    Micron unveiled the Micron Ventures Paradigm Fund, a US$250 million venture vehicle, in mid-August 2026, as the memory maker pairs more than US$25 billion in fiscal 2026 capex with...
    Tuesday 29 September 2026
    Column: Beyond Zero Trust – why AI supply chain resilience needs a plan B
    Artificial intelligence is rapidly entering enterprise operations, blurring the lines between cybersecurity and supply chain management. In the AI era, Zero Trust is no longer only...
    Tuesday 29 September 2026
    Behind CoWoS (part 2): How TSMC turned a niche packaging experiment into an industry standard
    As chip design enters the AI era, heterogeneous integration is driving foundry giants like TSMC, Samsung, and Intel to bring advanced front-end fab capabilities into back-end packaging...
    Tuesday 29 September 2026
    Behind CoWoS (part 1)—How a 0% yield crisis led to TSMC's first advanced packaging win
    In a recent interview on the DIGITIMES podcast, Dr. Shin-Puu Jeng, chairman of the International Microelectronics and Packaging Society (IMAPS) and a former longtime TSMC...
    Tuesday 29 September 2026
    Analysis: Elon Musk's AI safety push clashes with regulation

    Global AI has entered a period of dramatic turmoil, with leading researchers warning that top labs are "gambling with our lives" and...

    Monday 28 September 2026
    Column: For physical AI, maps are turning into memory
    A robot that can map a factory floor still cannot necessarily find the box it has been asked to move, or remember what it saw on its last visit. For autonomous robots, building the...
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    BIZ FOCUS
    Oct 1, 08:00
    Speed 3D Showcases On-Device AI Generation with Snapdragon X2 Elite
    Thursday 1 October 2026
    From Excel to Editable Presentations: AI Streamlines Financial Reporting
    Wednesday 30 September 2026
    Hackathon Team Optimizes Urban Evacuation Decision-Making
    Wednesday 30 September 2026
    AI Memory & Storage: The 5th GMIF2026 Innovation Summit Concludes
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