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Tuesday 17 October 2023
Chinese, Japanese, South Korean carmakers enable Asian SiC clusters' tremendous growth
The semiconductor industry expects SiC chip material shortages to be mitigated soon. Sources said with the improvement, global SiC producers are expected to ramp up in Asia, which...
Tuesday 17 October 2023
Taiwan and Japan opening up new horizons for further space collaboration
Hiroshi Yamakawa, the President of the Japan Aerospace Exploration Agency (JAXA), recently addressed in Taiwan Innotech Expo 2023. He underscored the significance of global collaboration...
Tuesday 17 October 2023
IC designers struggle with sustaining gross margin
The inability of IC design houses to reduce production costs and increase chip pricing is putting pressure on them to explore alternative strategies for sustaining profit margins,...
Tuesday 17 October 2023
Hybrid bonding technology crucial for realizing 3D DRAM
Some predictions suggest that as DRAM technology development is gradually approaching a bottleneck, hybrid bonding technology may be introduced into future DRAM manufacturing processes...
Tuesday 17 October 2023
New space age collaboration: how Taiwan's satellite supply chain is driving innovation
In a swiftly changing arena of space technology marked by intense competition on both domestic and international fronts, the concept of disruptive innovation and technology beckons...
Tuesday 17 October 2023
Taiwan's battery energy storage market expected to reach US$6.2 billion
As demand for energy storage systems and EVs rises, the battery industry continues to grow. Like many other countries, Taiwan is trying to localize battery production while facing...
Tuesday 17 October 2023
Nvidia CEO meets server ODMs in Taiwan
Nvidia CEO Jensen Huang is in Taiwan to meet with the company's server ODM partners, with the supply of Nvidia's H100 chips expected to be at the forefront of discussions.
Monday 16 October 2023
Foxconn has launched Taiwan's first trapped ion quantum computing lab
As one of the key pivots in implementing its 3+3 transformation strategy, Foxconn (Hon Hai) Technology Group's Hon Hai Research Institute held a trapped ion quantum computing laboratory...
Monday 16 October 2023
SK Hynix System IC encourages staff to take unpaid leave amid weak demand for 8-inch wafer foundry business
Seeing lackluster demand from the consumer electronics market for wafer foundry services, ZDNet Korea reported that SK Hynix System IC, a subsidiary of SK Hynix, is encouraging...
Monday 16 October 2023
South Korea semiconductor exports approach 11-month high thanks to memory and EVs
South Korea's economic backbone, its exports, is displaying promising signs, injecting much-needed vitality into its sluggish economy. Analysts are pointing to the combined factors...
Monday 16 October 2023
IC design houses remain wary about placing orders with foundries
Despite their sales results reflecting a pick-up in customer orders, Taiwan-based IC design houses intend to be cautious when placing orders with their foundry partners, according...
Monday 16 October 2023
South Korean memory industry accelerates DDR5 production expansion
High-performance DDR5 demand is gradually increasing, and memory industry players are taking measures in response to market changes. Recently, news from the South Korean industry...
Monday 16 October 2023
ADT to tape out 3nm/2.5D chip to be manufactured by Samsung
ADTechnology (ADT), an IC design house based in South Korea, has reportedly received a contract to design a 3nm/2.5D semiconductor chip and will tape out and have the product manufactured...
Monday 16 October 2023
TSMC founder Morris Chang sounds alarm on shrinking competitiveness amid eroding globalization
TSMC founder Morris Chang cautioned that TSMC's edge in the semiconductor industry may erode due to geopolitical and economic challenges. He believes Japan is expected to stand out...
Friday 13 October 2023
Samsung set to roll out HBM4 in 2025 incorporating advanced packaging solution
Samsung Electronics has unveiled a strategic memory roadmap, aiming to release a new generation of high-bandwidth memory (HBM) product, HBM4, by the year 2025. In this ambitious endeavor,...