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IN THE NEWS
Friday 18 September 2026
Winbond cements server NOR lead with Infineon deal
Winbond Electronics is expanding its NOR Flash footprint and has agreed to pay US$1.12 billion in cash to acquire Infineon's NOR Flash and F-RAM businesses, a move that will lift it...
Friday 18 September 2026
Corning to raise display glass substrate prices 15% from 4Q26
Corning, the US glass substrate supplier, will raise prices for its yen-denominated display glass substrate products by 15% or more worldwide starting in the fourth quarter of 2026,...
Friday 18 September 2026
ByteDance's second AI-agent phone drops forced automation for permission — yet app wall still up
The question facing China's "AI agent phone" category is no longer whether a model can drive a smartphone. It is whether the apps will let it. Judging by the first mass-produced device...
Friday 18 September 2026
Winbond's Infineon buyout puts GigaDevice under pressure

Winbond Electronics' US$1.12 billion acquisition of Infineon's NOR Flash and ferroelectric RAM (F-RAM) businesses has drawn close attention...

Thursday 17 September 2026
Physical AI drives autonomous driving upgrade; three efficiency factors lift AI accelerator demand
End-to-end autonomous driving has become the mainstream technology path, and the inference demand created by Physical AI in autonomous driving systems is, in turn, reshaping automotive...
Thursday 17 September 2026
China optical suppliers power smart glasses supply chain
China's optical suppliers are playing a growing role in the global smart glasses, VR, and AR supply chain as AI glasses demand accelerates worldwide. Industry sources say more than...
Thursday 17 September 2026
China's LCD trio flexes newfound pricing power as Taiwan panel makers retreat
China's top three liquid-crystal display (LCD) panel makers have sent written price-increase notices to customers for the first time, as Taiwan's leading panel makers sell factories...
Thursday 17 September 2026
China's FAW may become GAC's second-largest shareholder, possibly restructuring the Toyota China model

Consolidation chatter within China's automotive industry has reignited following an announcement by Guangzhou Automobile Group (GAC...

Thursday 17 September 2026
Onsemi puts power density at the center of its next-decade strategy

Onsemi is seeking to capture more value from AI, electrification, and automation by expanding from individual semiconductors into integrated...

Thursday 17 September 2026
Intel CEO warns of 2027 memory crunch and tighter CPU supply
AI infrastructure expansion is turning memory supply into a major bottleneck for the semiconductor industry. Intel CEO Lip-Bu Tan warned that the memory shortage in 2027 could be worse...
Thursday 17 September 2026
Apple's foldable phone puts thinness, weight in focus

Apple's first foldable phone has sharpened global attention on smartphone design trade-offs, with weight, thickness, and component miniaturization...

Wednesday 16 September 2026
Infineon exits NOR Flash with US$1.12 billion sale to Winbond, reviving Spansion name
Winbond Electronics will buy Infineon Technologies' NOR Flash and F-RAM business for US$1.12 billion in cash and rename it Spansion, the name of the US memory pioneer whose NOR Flash...
Wednesday 16 September 2026
Soaring memory costs threaten Netronix's e-reader growth, even as new display markets stay on track
Netronix said rapidly rising memory prices are squeezing the consumer electronics supply chain, raising e-book reader costs and slowing some e-paper display projects. Even so, the...
Wednesday 16 September 2026
Samsung Exynos regains share as Galaxy phones test 2nm

Samsung Electronics' in-house Exynos application processors (APs) are steadily regaining lost ground in the global smartphone market...

Wednesday 16 September 2026
Physical AI could reshape industrial computing as Ennoconn sees a long growth cycle

Artificial intelligence is moving beyond software and into physical systems, and Ennoconn Technology says that shift could create a...