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Monday 8 December 2025
Research Insight: 800V systems, LiDAR, and multi-screen cabins dominate China's 2025 models

The 2025 Guangzhou International Automobile Exhibition concluded on Nov. 30, offering one of the clearest snapshots yet of where China's...

Monday 8 December 2025
3Q25 global top 20 EMS/ODM rankings: Chinese firms shift to automotive electronics and AI servers
The global electronics manufacturing services (EMS) and original design manufacturing (ODM) supply chain experienced many structural changes during the third quarter of 2025. In the...
Monday 8 December 2025
Yeong Guan boosts global wind presence with China surge and 2026 Thailand plant launch
Taiwan's major castings supplier Yeong Guan Energy Technology Group, a key producer of components for wind turbines, machine tools, and heavy industrial equipment, is deepening its...
Monday 8 December 2025
Samsung reportedly gains momentum in foundry and memory with improved 4nm yields
Samsung Electronics is reportedly gaining momentum across its foundry and memory operations as higher yields on its 4nm process and a broad recovery in DRAM demand position the company...
Monday 8 December 2025
Geopolitics push AI chip packaging into Taiwan-US duopoly
Geopolitical realignments are accelerating a reshaping of the global outsourced assembly and test (OSAT) landscape. Industry analysts say that over the next five years, advanced AI-chip...
Monday 8 December 2025
Tesla mounts late-2025 China comeback as Europe sales crater
Tesla, the world's leading electric-vehicle maker, mounted a striking late-2025 comeback in China's battery-electric market — a rebound that stands in sharp contrast to the...
Monday 8 December 2025
Apple poised to overtake Samsung in 2025 smartphone shipments
Samsung Electronics is facing mounting challenges in the global smartphone market, with Apple poised to overtake the top spot in shipment volume in 2025 amid rising exchange rate...
Monday 8 December 2025
SK Hynix reportedly delays HBM4 mass production amid Nvidia Rubin AI accelerator launch plans
SK Hynix has reportedly postponed the mass production timeline for its sixth-generation high bandwidth memory (HBM4) from the end of the second quarter of 2026 to the third quarter...
Monday 8 December 2025
Foxconn leads global EMS market with strong AI and Apple momentum
According to DIGITIMES' latest EMS/ODM revenue ranking report, Taiwan has a significant dominance in the sector. Taiwanese firms account for 70% of the top 20 EMS/ODM companies, with...
Monday 8 December 2025
China expected to surpass Taiwan as second-largest IC design revenue generator by 2026, IDC forecasts
According to IDC's latest forecast, released on December 5, 2025, China is expected to overtake Taiwan, accounting for the world's second-largest integrated circuit (IC) design revenue...
Monday 8 December 2025
Weekly news roundup:Intel hires TSMC veteran, Samsung reportedly wins TPU HBM4 order
These are the most-read DIGITIMES Asia stories in the week of December 1 to December 7, 2025.
Monday 8 December 2025
Auto supply chains face stricter demand for non-Chinese standards
As geopolitical tensions between China and multiple countries intensify alongside China's aggressive expansion into overseas automotive markets, supply chain players reveal that customer...
Monday 8 December 2025
Samsung shifts focus from HBM to DDR5 modules for higher profits
Samsung Electronics has shifted its internal strategy in response to intensified HBM market competition**,** reallocating capacity toward DDR5 RDIMM modules and freeing up around...
Monday 8 December 2025
Schmidt says China’s AI ascent is losing lift as capital thins—but the real bubble, he argues, is in doubting AI
Eric Schmidt, former Google CEO, has warned that China may fall behind the US in artificial intelligence (AI) development due to restricted access to funding. Speaking at a Harvard...
Monday 8 December 2025
Ritek revives growth by becoming an AI infrastructure dark horse

Ritek Group CEO Wang Ting-chang said the group has long invested in AI-linked fields such as power, semiconductor materials, and packaging...