Intel, Qualcomm, Google, and other industry titans have formed the Unified Acceleration (UXL) Foundation, an open accelerator software ecosystem aimed at challenging Nvidia's market...

Chinese state-backed enterprises are expanding their presence in the semiconductor industry, the latest example being China Resources' takeover of backend house Jiangsu Changjiang...

ASML's future may be decided by Beethoven.

Lam Research has announced what it claims is the world's first production-oriented Pulsed Laser Deposition (PLD) technique for next-generation MEMS microphones and Radio Frequency...

Chang Wah Electromaterials (CWE) has signed a five-year syndicated loan agreement for NT$3 billion (US$94 million) with 12 local banks in Taiwan, according to the semiconductor materials...

In the wake of the unveiling of India's US$1.25...

Zhuhai Aerospace Microchips Science & Technology Co. (Aero-Chips), formerly known as Zhuhai Orbita Aerospace Science & Technology Co., is deploying its AI chips into space...

Taiwan's wafer foundry industry will experience a sequential decline in first-quarter 2024 revenues before a rebound in the second quarter.

Taiwan-based ASIC designers are quietly seeking business opportunities arising from China's prohibition on the public sector's use of US chips, according to industry sources.

There is speculation regarding a closer partnership between MediaTek and Nvidia in the automotive sector and beyond.

ST wants a stronger presence in the MCU market.

US-headquartered xMEMS is on track to redefine Micro Electro Mechanical System (MEMS) speakers.

Huawei Central website quoted a chipset spec sheet leaked onto the Internet, highlighting that the chip is manufactured using the SMIC 5nm process.

Retired former TSMC R&D director Konrad Young said China's semiconductor industry will eventually become an independent ecosystem and develop its systems under the US sanctions...

Foxconn Interconnect Technology (FIT), a subsidiary of Hon Hai Technology Group (Foxconn), has partnered with MediaTek to co-develop a groundbreaking 51.2T solution incorporating...