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IN THE NEWS
Friday 22 February 2019
Advantest completes acquisition of semiconductor system level test business from Astronics Corporation
Leading semiconductor test equipment supplier Advantest Corporation has announced that it has closed its previously announced acquisition of the commercial Semiconductor System Level...
Friday 22 February 2019
MediaTek reiterates target gross margin of 40% for 2019
MediaTek CEO Rick Tsai reiterated at a recent press event the company's gross margin target of 40% this year, and said the mobile SoC specialist is confident about the competitiveness...
Friday 22 February 2019
Taiwan developing neuromorphic chips beyond AI limitations
An academic research team in Taiwan is developing neuromorphic computing solutions, seeking to lead the world in breaking through AI limitations and help domestic chipmakers work...
Thursday 21 February 2019
Huawei demanding capacity support from Taiwan backend partners
Huawei has demanded sufficient capacity support from its Taiwan-based backend partners for the end of 2019 and the middle of 2020, as the device vendor is gearing up for 5G with plans...
Thursday 21 February 2019
China small- to mid-size AMOLED capacity to surge 59% CAGR 2018-2022, says Digitimes Research
Aggregate production capacity for small- to medium-size AMOLED panels at China makers is expected to expand at a CAGR of 59.4% from 2018-2022, according to Digitimes Research.
Thursday 21 February 2019
Taiwan must run faster in IC development: Q&A with science minister Chen Liang-gee
TSMC is likely to kick off volume production of 3nm manufacturing process in 2022-2023, when AI and 5G applications are seen to explode to drastically drive the growth of mobile communications,...
Thursday 21 February 2019
Himax expects sales drop in 1Q19
Himax Technologies expects to post a revenue decline of 14-19% sequentially in the first quarter of 2019, when the fabless chipmaker expects its LCD driver IC sales generated from...
Thursday 21 February 2019
Infineon stepping up outsourcing to Taiwan makers
Infineon will be stepping up its outsourcing of commodity products to Taiwan-based foundries and backend houses, while keeping the production of its differentiated products that generate...
Wednesday 20 February 2019
China smartphone AP shipments to drop 25% in 1Q19, says Digitimes Research
Smartphone application processor (AP) shipments to China vendors in fourth-quarter 2018 declined 10% on quarter with system manufacturers adjusting shipment targets downward. As system...
Wednesday 20 February 2019
Taiwan makers facing competition from China for car-use PCBs
Taiwan-based PCB makers are facing fierce price competition from China-based rivals in the mid-range to entry-level segments of the car-use electronic component industry, but in the...
Wednesday 20 February 2019
IC packager Xintec expects revenues to pick up in 2Q19
Image sensor packaging specialist Xintec expects a significant sequential revenue pickup in the second quarter of 2019 due mainly to faster inventory adjustments at 3D sensor supply...
Wednesday 20 February 2019
TSMC to pay NT$10 cash dividend in 2019
Taiwan Semiconductor Manufacturing Company (TSMC) has decided to distribute a total of NT$10 (US$0.32) cash dividend per share this year.
Wednesday 20 February 2019
MEMS environment sensing hub under development for diverse applications
Along with rampant IoT development, MEMS-based sensing solutions will be increasingly applied to diverse segments such as smartphones, wearable electronics devices, and automotive...
Tuesday 19 February 2019
Zhen Ding revenues plummet in January
Zhen Ding Technology, reportedly among the flexible PCB suppliers for Apple's iPhones, saw its revenues for January 2019 plummet 20.57% on month and 38.02% on year to NT$7.50 billion...
Tuesday 19 February 2019
China smartphone AP shipments – 4Q 2018
Smartphone application processor (AP) shipments to China in fourth-quarter 2018 declined 10% quarter over quarter with system manufacturers adjusting shipment targets downward.