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IN THE NEWS
Friday 21 December 2018
IBM expands tie-up with Samsung to include 7nm chip manufacturing
IBM has announced an agreement with Samsung to manufacture 7nm microprocessors for IBM Power Systems, IBM Z and LinuxONE, high-performance computing systems, and cloud offerings.
Friday 21 December 2018
AMEC 5nm plasma etching tools verified by TSMC
Advanced Micro-Fabrication Equipment (AMEC) announced recently its in-house developed 5nm plasma etching tools have been verified by Taiwan Semiconductor Manufacturing Company (TSM...
Thursday 20 December 2018
No surprises if Intel quits contract chipmaking market
Intel's recent announcement about refocusing its manufacturing resources on its own products has raised speculation again that the company may discontinue its so-called custom foundry...
Thursday 20 December 2018
Foundries see orders for TDDI chips, fingerprint sensors ramp up
Taiwan Semiconductor Manufacturing Company (TSMC) and United Microelectronics (UMC) have both seen their fabless customers particularly those engaged in the TDDI (touch and display...
Thursday 20 December 2018
CIS demand set to grow robustly in 2019
The market for CMOS image sensors is expected to see robust growth in 2019, thanks to brisk demand for multi-lens handsets, cars equipped with ADAS capabilities, and security control...
Thursday 20 December 2018
North America semi equipment industry billings fall in November, says SEMI
North America-based manufacturers of semiconductor equipment posted US$1.94 billion in billings worldwide in November 2018 (three-month average basis), according to SEMI. The billings...
Thursday 20 December 2018
SST, SK Hynix partner to expand availability of embedded SuperFlash technology
Microchip Technology via subsidiary Silicon Storage Technology (SST) has announced a strategic partnership with SK Hynix System IC to expand the availability of SuperFlash technology...
Thursday 20 December 2018
Xilinx ADAS SoC adopted by BYD
Xilinx has announced its Zynq-series SoC for advanced driver assistance systems (ADAS) has been adopted by China-based electric vehicle vendor BYD.
Thursday 20 December 2018
Rigid-flex PCB demand promising
The overall demand for handset PCBs is being affected negatively by the global deceleration in smartphone sales. However, rising adoption of multi-lens cameras by smartphones is set...
Wednesday 19 December 2018
Foxconn healthcare foundation to partner with Merck for biotech development
A healthcare foundation founded by Foxconn Group chairman Terry Guo has signed an MoU with the Merck Group for establishing H.Spectrum & Merck Innovation Lab to develop bio-chip...
Wednesday 19 December 2018
USB Type-C chip prices to fall over 20% in 2019
USB Type-C interface devices are increasingly applied to a variety of consumer electronics gadgets, prompting major Taiwan IC design houses to deepen their deployments in related...
Wednesday 19 December 2018
Huawei, Xiaomi expect 2019 smartphone shipments to surge over 20%
Despite slack demand in China's smartphone market and unclear global outlook, China-based vendors Huawei and Xiaomi have estimated their smartphone shipments for 2019 to surge over...
Wednesday 19 December 2018
Glass substrate, liquid crystal suppliers to be hit most by CPT production halt
Suppliers of glass substrates and liquid crystal materials for Chunghwa Picture Tubes (CPT) are likely to incur the highest amounts of arrears due to the recent shutdown of CPT's...
Wednesday 19 December 2018
Flexium approves NT$8 billion for 2019 capex
The board of directors of flexible PCB specialist Flexium Interconnect has approved plans to budget NT$8 billion (US$259.5 million) in capex for 2019, which will be utilized for capacity...
Wednesday 19 December 2018
PCB makers trialing AI-based recognition modules to support AOI
Taiwan-based PCB makers are trialing AI-based recognition modules to hike accuracy for automatic optical inspection (AOI), according to industry sources.