DIGITIMES: News and Insight of the Global Supply Chain

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TSIA 30: The manpower problem behind Taiwan's semiconductor resilience

Oct 31, 07:34

SEMICONDUCTORS

Radiant targets next-gen CPO above 6.4T, eyes 2028 mass production

Oct 31, 07:32

SEMICONDUCTORS

DIGITIMES Insight: Arm extends from IP licensing to server CPU products, with strong growth potential in China

Oct 31, 02:59

ICT

Interview: Why this Taiwan mmWave maker chose to sidestep SpaceX and look to niche markets for demand

Oct 31, 00:41

INTERVIEWS

AUO targets major revenue contribution from optical engines, glass core substrates within 2 to 3 years

Global smartphone shipments fall 14% as brands launch more 5G models

TSIA 30: AI is breaking the sequential supply chain — Taiwan may be built for what comes next

Compeq plans sustained investment as AI infrastructure, LEO satellite demand grows

Ibiden expands AI packaging substrate capacity for Intel from 2029

Renesas expands AI data center capacity, targets 33.2% margin in 2026

Infineon's 300mm GaN push turns Europe's power-chip strength into an AI infrastructure bet

From living neurons to enterprise AI: TBC pursues faster video generation with AWS

Honda targets Level 4 autonomy by 2027, AI maps by 2030

Micron says 700-plus Taiwan fab workers earned five years' salary in a single year

Realtek targets 30% AI revenue share by 2030

HHTD 26: Mitsubishi Electric Mobility to join Foxconn in 2027, targeting JPY1T revenue by 2030

Holtek lands major server cooling contract, AI thermal demand soars

HHTD 26: The year robots share the stage with AI infrastructure

Eutelsat eyes EUR10B revenue from IRIS2 as EU seeks homegrown answer to Starlink

C Sun Mfg invests in Nemstek to expand advanced packaging equipment

Taiwan's economic indicator signals 'booming' for 10th straight month on AI-driven shipments

SK Hynix taps HBM veteran to lead new American unit

Google, Foxconn aims to cut AI infrastructure deployment to six months

HHTD 26: Foxconn unveils three new EVs, expanding Model A and K platforms

Foxconn, TECO showcase factory-built infrastructure for AI data center expansion

Foxconn argues it is more than a box mover in AI hardware

China's memory module bellwethers post record profits as 3Q26 momentum fades

Samsung SDI posts 12-quarter high in 3Q26 operating profit

VinFast aims to make India one of its two largest markets as overseas sales trail target

Nvidia secures substrate capacity as FCBGA market targets US$27.3 billion by 2030

More news

BIZ FOCUS

Oct 30, 08:00

Macronix to Showcase Automotive and IoT Memory Solutions at electronica 2026

MOST-READ

MULTIMEDIA

K-Safety Expo 2026: Safety, rewired, AI takes the front line at the edge of Busan blue

According to DIGITIMES observations and analysis, smartphone memory contract prices in the first half of 2026 often rose 50% to 80% quarter-over-quarter.

According to DIGITIMES, Agentic AI, AI server expansion, cloud service provider (CSP) in-house CPU ramp-up, and replacement demand for general-purpose servers will lift global server CPU shipments to 52.6 million units in 2027, up 45.7% year-over-year, wi12_s.jpg

DIGITIMES says the most closely watched model in Apple's high-end iPhone 18 lineup, launched in September 2026, is the long-anticipated first foldable smartphone, the iPhone Duo.