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CONNECT WITH US
Sep 19, 07:15
CXL adds memory capacity, but HBM retains its bandwidth edge
Sep 19, 07:15
Compal takes Compal Broadband Networks private to fold networking into its edge AI stack
Sep 19, 07:17
Charts: Taiwan's memory makers are outgrowing TSMC by a factor of eight
Sep 19, 07:17
Beyond Volkswagen, XPeng seeks to turn automotive R&D into a global tech enterprise
Sep 19, 07:21
Amazon Leo clears Taiwan's NCC review, with commercial launch pointed at 2027
LATEST STORIES
7 days news
Power grids can't keep pace with AI data center boom in EU, US
Sep 19, 07:20
ICT
Memory recovery, price hikes lift Niching IC substrate outlook, order visibility through 2H27
Sep 19, 07:19
SEMICONDUCTORS
MediaTek, Vivo bring 30B MoE models on-device in next AI phone race
Sep 19, 07:18
ICT
Interview: Advanced packaging shifts toward system-level co-design for AI
Sep 19, 07:18
INTERVIEWS
Thailand plans to swap EV subsidies for import taxes to defend its production base
Ams OSRAM takes an automotive-qualified force sensor into robotic hands
Ventec invests NT$1.5 billion in Kunshan expansion for AI, HDI orders
Solidigm weighs first US NAND fab, explores upstate New York
Analysis: China's 15th five-year plan spotlights diamond for AI chip thermal management
Winbond cements server NOR lead with Infineon deal
Corning to raise display glass substrate prices 15% from 4Q26
CXMT eyes NAND amid global shortage, taking aim at YMTC
Doosan commits KRW968 billion to CCL expansion as demand strains capacity
China's AI data center token costs hinge on access to advanced GPUs
China's memory push gains ground across LPDDR6, advanced NAND, with HBM still the test
CoreWeave launches US$3 billion bond sale amid growing revenue, debt
High-end GPUs may be slowing China's AI compute expansion
LGES, Samsung SDI reportedly booked out for two years as US restrictions and China slowdown reshape ESS market
Chip equipment makers face waits of up to 40 months for critical parts
Samsung deepens Euclyd ties as startup reportedly reaches test-chip stage
King Charles tests AI's safety consensus as Nvidia keeps its foot on the accelerator
CPO raises PCB downgrade concerns but switches stick with M8 CCL
iPhone 18 Pro sellouts across Taiwan as foldable Duo looms
ByteDance's second AI-agent phone drops forced automation for permission — yet app wall still up
Mobile SoC battle for 2026 centers on NPUs
Micron: AI memory crunch rewrites the market with long-term deals and custom designs
ByteDance builds strong supply chain force to master emerging hardware ecosystems beyond core demand
GlobalFoundries, Marvell expand SiGe capacity deal for AI optical connectivity
NCSIST showcases military tech at Taiwan Innotech Expo 2026
Foldable smartphone panel shipments fall 13% in 1H26 as market shifts to in-fold designs
More news
BIZ FOCUS
Sep 18, 14:29
SK hynix Launches 'SK hynix Ventures' in Silicon Valley
Monday 14 September 2026
Hauman Unveils Micro LED Testing Breakthrough for AI Optical Interconnects
Monday 14 September 2026
Scaling Photonics: Assembly, Test and Fiber Automation at SEMICON Taiwan
Friday 11 September 2026
Toward Technologies Redefines Relay Solutions at SEMICON Taiwan 2026
MOST-READ
Update: ABF substrate maker Unimicron searched in origin-labeling probe
Qualcomm's HBC play pulls Samsung and SK hynix into a new race beyond HBM
Samsung, SK Hynix step up China NAND upgrades as US tool risks grow
Google TPU pays back investment in 1 year, creating upside for MediaTek, Broadcom ASIC revenues
ASML lines up Intel, TSMC and Samsung behind 12-inch masks — TSMC alone sets a timeline
TSMC 3nm, 2nm, and CoWoS stay tight as AWS, MediaTek, TPU shift capacity
Winstar's AI push gains momentum with some orders extending into 2027
MULTIMEDIA
K-Safety Expo 2026: Safety, rewired, AI takes the front line at the edge of Busan blue
CIOE 2026
The 27th China International Optoelectronic Exposition (CIOE 2026) took place September 9-11 in Shenzhen, bringing together more than 5,000 exhibitors from over 30 countries and regions.
As AI data centers hit a transmission wall, GlobalFoundries pushes into silicon photonics
AR glasses target 2 billion myopia users as China supply chain eyes doubling shipments
Sivers Semiconductors positions laser arrays as solution to copper's limits
...More
EV
Wednesday 9 September 2026
Analysis: When 72% of the world's EV batteries are Chinese, one defect travels
CATL looks beyond China's passenger-car squeeze as electric trucks become the next growth front
Friday 18 September 2026
LGES, Samsung SDI reportedly booked out for two years as US restrictions and China slowdown reshape ESS market
Friday 18 September 2026
Tier IV open-sources self-driving AI chip design to challenge Nvidia
Thursday 17 September 2026
TECH
Friday 18 September 2026
Global chipmakers answer India's pitch with equipment, materials, and R&D — not fabs
Exclusive: China's CAS institute charts DUV route to 3nm GAA without EUV
Thursday 17 September 2026
Exclusive: Wiwynn expands US, Mexico plants, aiming to double capacity by 2027
Wednesday 16 September 2026
Google TPU pays back investment in 1 year, creating upside for MediaTek, Broadcom ASIC revenues
Monday 14 September 2026
ASIA
Thursday 10 September 2026
India's fraud office seeks a Xiaomi probe as the market it once led shrinks around it
Analysis: China's 15th five-year plan spotlights diamond for AI chip thermal management
Friday 18 September 2026
Solidigm weighs first US NAND fab, explores upstate New York
Friday 18 September 2026
High-end GPUs may be slowing China's AI compute expansion
Friday 18 September 2026
OPINIONS
Friday 18 September 2026
Analysis: China's 15th five-year plan spotlights diamond for AI chip thermal management
The Trump-Jensen speakerphone diplomacy: how Nvidia turned political pressure into a seat at the table
Thursday 17 September 2026
Column: China tightens rare earth controls, exposing hidden vulnerabilities in Taiwan's supply chain
Thursday 17 September 2026
DIGITIMES Insight: Google outlines AI compute expansion, speeds TPU cycle to 6 months
Wednesday 16 September 2026
TOPICS
CIOE 2026
TSMC UPDATES
LG ENERGY SOLUTION
HUAWEI
SPECIAL REPORTS
Thursday 17 September 2026
Physical AI drives autonomous driving upgrade; three efficiency factors lift AI accelerator demand
End-to-end autonomous driving has become the mainstream technology path, and the inference demand created by Physical AI in autonomous driving systems is, in turn, reshaping automotive system-on-chip (SoC) design.
Wednesday 16 September 2026
Global top-3 memory maker status, 3Q 2026: AI servers drive record memory revenue; SSD, LPDDR upgrades ahead
DIGITIMES observes that major memory suppliers posted record-high revenue in the second quarter of 2026, with yearover-year growth remaining in the triple digits. Driven by AI demand, SSDs and LPDDR are emerging as key competitive
battlegrounds.
Tuesday 15 September 2026
AI demand reshapes capital allocation and operating models in telecom sector
Although the global 5G mobile communications market is still growing in 2025, higher 5G user penetration has not necessarily translated into equivalent revenue growth for telecom operators, while annual growth in mobile data traffic has continued to slow.
Monday 14 September 2026
Notebook shipment update, July 2026
DIGITIMES' survey of July 2026 notebook shipments (excluding detachable models) from the world's top five notebook brands (excluding Apple) and the top three notebook ODMs
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