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CONNECT WITH US
Sep 11
Taiwan unfazed by Trump's renewed chip tariff threat as MOU already locks in preferential US treatment
Sep 11
Kioxia eyes US listing amid NAND profit rebound
Sep 11
Huawei stakes out the AI optics rulebook with 7.2Tbps NPO
Sep 11
ASE to buy AOI, AVI equipment from Machvision for NT$334M
Sep 11
Micron brings forward record pay amid Taiwan strike threat
LATEST STORIES
7 days news
Interview: Resonac maps five PLP hurdles, eyes 510x515mm pilot line
Sep 12, 05:45
INTERVIEWS
Luxshare eyes AR glasses breakthrough through car HUD model
Sep 12, 02:48
EAST ASIA
Charts: Taiwan's AI supply chain growth moves from cooling to rack hardware
Sep 12, 00:05
ICT
Why Chinese automakers' aggressive push only further tightens CATL's grip
Sep 11
EAST ASIA
Chipmaking equipment spending could hit US$270 billion by 2030, Futurum says
Samsung Electro-Mechanics, LG Innotek vie in AI package substrates
Memory makers gain the upper hand as Apple's iPhones pay the price
AUO, Innolux accelerate shift from displays to AI, CPO, advanced packaging
Apple phones drive premium upgrade wave for carriers
ficonTEC breaks CPO test bottleneck, teams with Hermes Testing
Enflame enters public markets with Nvidia alternatives in its sights
CPO startup Ayar Labs raises 2026 funding to US$650 million, adds Wiwynn as investor
Beyond Earth's orbit: how Besxar, Space Forge, Varda, BioOrbit, Voyager are industrializing space
Innolux factory shift could reshape InnoCare's supply chain and growth mix
China's DRAM supply chain clears another materials hurdle
CIOE: Hitachi relies on partnerships, not proprietary tech, to ride China's optical boom
Samsung's Exynos gains ground as Galaxy S26 lifts share to 9%
Taiwan govt boosts EDA R&D to target global gaps
CIOE 2026: Automotive optical-module demand could rival FTTx shipments by 2030
China's energy storage capacity surges 50-fold in five years, sparking crackdown on lithium battery expansion
AI packaging turns to glass, with TGV metallisation persisting as key technical hurdle
Apple cracks mmWave with C2, weakening Qualcomm's last big iPhone modem edge
Nvidia expands Australian AI factory push as global demand rises
Apple's new chip packaging boosts A20 Pro AI power, pushing MediaTek, Qualcomm to follow suit
CIOE 2026: Smartphone camera market faces deeper slump as Apple draws attention in Shenzhen
Altera eyes $2B IPO, from Intel carve-out to public debut
SK Hynix raises cash portion of bonuses after 25-vote union rejection
Huawei, Xiaomi, Apple take different bets on foldables
Global drone supply chain accelerates de-China shift, Taiwan wins
FCC closes a chip-level loophole while media debate another White House retreat
More news
BIZ FOCUS
Sep 11, 08:00
DAS Expands in Taiwan and Unveils World First at SEMICON
Friday 11 September 2026
Toward Technologies Redefines Relay Solutions at SEMICON Taiwan 2026
Thursday 10 September 2026
Stress, Sleep, and Lifestyle Balance: Perspectives from Traditional Chinese Medicine
Wednesday 9 September 2026
IDA Partners with Taiwan's Semiconductor Industry to Advance Global Talent Strategy
MOST-READ
Tungsten prices surge sixfold as US-China restrictions tighten supply for chips, aerospace, defense
Google's v10 TPU opens door to AMD without sidelining Broadcom, MediaTek
Nvidia Feynman pushes TSMC A16 and CPO ramp
Update: ABF substrate maker Unimicron searched in origin-labeling probe
Qualcomm's HBC play pulls Samsung and SK hynix into a new race beyond HBM
SK keyfoundry expands 8-inch capacity as China demand strains supply
Samsung, SK Hynix step up China NAND upgrades as US tool risks grow
MULTIMEDIA
K-Safety Expo 2026: Safety, rewired, AI takes the front line at the edge of Busan blue
Semicon Taiwan 2026
Semicon Taiwan 2026 took place on September 2-4, 2026, at TaiNEX 1&2, Taipei, with the event tagline of "Transform Tomorrow".
DAS Expands in Taiwan and Unveils World First at SEMICON
Toward Technologies Redefines Relay Solutions at SEMICON Taiwan 2026
d-Matrix brings Raptor chips to Nvidia racks as falling token prices pressure GPU economics
...More
EV
Wednesday 9 September 2026
Analysis: When 72% of the world's EV batteries are Chinese, one defect travels
CIOE 2026: Automotive optical-module demand could rival FTTx shipments by 2030
Friday 11 September 2026
China's energy storage capacity surges 50-fold in five years, sparking crackdown on lithium battery expansion
Friday 11 September 2026
China sets clear limits on payment terms to auto suppliers
Thursday 10 September 2026
TECH
Friday 11 September 2026
Micron brings forward record pay amid Taiwan strike threat
Qualcomm's AWS deal raises stakes for MediaTek and Alchip
Thursday 10 September 2026
Kioxia rules out deeper SK Hynix ties, resists further NAND price hikes
Wednesday 9 September 2026
SEMICON Taiwan 2027 move to August highlights venue pressure, not anniversary tie-in
Monday 7 September 2026
ASIA
Thursday 10 September 2026
India's fraud office seeks a Xiaomi probe as the market it once led shrinks around it
Taiwan unfazed by Trump's renewed chip tariff threat as MOU already locks in preferential US treatment
Friday 11 September 2026
Enflame enters public markets with Nvidia alternatives in its sights
Friday 11 September 2026
CIOE 2026: Automotive optical-module demand could rival FTTx shipments by 2030
Friday 11 September 2026
OPINIONS
Thursday 10 September 2026
Analysis: China chases EUV as chipmakers move to High-NA
Commentary: Huawei's Kirin comeback, Xiaomi's Xring entry widen China's chipmaking race
Wednesday 9 September 2026
Exclusive Interview: WG Tech sees a faster route for TGV beyond displays
Wednesday 9 September 2026
Analysis: When 72% of the world's EV batteries are Chinese, one defect travels
Wednesday 9 September 2026
TOPICS
SEMICON TAIWAN 2026
GEOWATCH
HUAWEI
5G
SPECIAL REPORTS
Thursday 10 September 2026
From cHBM to 3D Stacked SRAM, AI inference drives AI accelerators toward memory architecture innovation
DIGITIMES identifies three main directions for memory development in cloud AI accelerators: processing near memory, 3D Stacked SRAM, and high-bandwidth flash.
Wednesday 2 September 2026
Global smartphone industry, 2Q 2026
According to DIGITIMES, smartphone memory contract prices surged by 50% to 80% in the first half of 2026, prompting most vendors to continue cutting shipments of mid- and low-end models and to raise product prices.
Friday 28 August 2026
AI data center 800VDC power architecture takes shape; future hurdles require balancing multiple key factors
DIGITIMES believes that 2026 will be a pivotal year in the stabilization of 800VDC power architectures for AI data centers.
Wednesday 26 August 2026
Growth in low-Earth-orbit satellite communications accelerates; further boosts demand for GaN components
DIGITIMES has observed that since SpaceX began using reusable rockets for launch missions, its payload capacity has continued to rise.
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