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Special reports
17 May 2024
Deployment of Taiwan IPC industry in Southeast Asia
16 May 2024
Wi-Fi 7 applications and tech development
10 May 2024
China smartphone market, 1Q 2024
10 May 2024
China smartphone AP shipments, 1Q 2024
10 May 2024
China smartphone industry, 1Q 2024
7 May 2024
Taiwan notebooks, 1Q 2024
3 May 2024
Global server market, 1Q 2024
2 May 2024
In-house AI chip R&D of US, China major CSPs
30 Apr 2024
Liquid and air cooling solutions for AI servers
18 Apr 2024
Taiwan IPC makers operation status
12 Apr 2024
Android adoption of Gemini for gen AI
9 Apr 2024
Global smartphones, 4Q 2023
A-la-carte reports (single reports)
2 Oct 2023
Samsung strategy and capacity deployment in India and Vietnam
8 Sep 2023
Status of global wafer foundry industry, 2023
BIZ FOCUS
May 14, 13:54
TPCA teams up with Taiwanese industry association to bolster talent and supply chains in Thai electronics manufacturing expansion
Thursday 9 May 2024
Power suppliers and BLDC motor drivers from Mean Well in time
Thursday 9 May 2024
SK Hynix develops next-generation mobile NAND solution ZUFS 4.0
Tuesday 7 May 2024
ABB Technologies at core of Net Zero transition
TOP STORIES
7 DAYS NEWS
Speculation arises about Huawei developing Kirin PC chips
Huawei chip development receives all-out support from Chinese semiconductor firms
TSMC may soon see 3nm capacity supply fall short of demand
Apple said to have signed pact with Samsung Display for foldable devices
Samsung HBM3E reportedly unable to pass Nvidia verification due to TSMC's standard
Intel steps up equipment and material orders for advanced packaging
China chip demand is rebounding, but 2H24 outlook remains opaque
Applied Materials projects significant revenue growth from GAA, sparking major chipmakers showdown in 2025
Topco sees strong orders from Chinese foundries
IEIT, FII enjoy robust AI server demand in China
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