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| Frankly speaking |
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DIGITIMES regularly interviews leading industry executives, inviting them to talk frankly about the technology issues and the business challenges of our rapidly changing industry. We always welcome the opportunity to discuss industry trends and issues face-to-face, via email or during a conference call. The text is available free of charge for three days after publish date; older interviews require membership. Please contact us if you're interested in arranging an interview. |
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25 Jun 2008: | From Hollywood to your digital life: Q&A with Dolby marketing vice president Francois Modarresse |
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23 Jun 2008: | Dennis Chen, chairman of LED chipmaker Huga Optotech |
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18 Jun 2008: | No plan for 450mm wafer migration yet: Q&A with Chartered CEO Song-Hwee Chia |
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16 Jun 2008: | Rohm & Haas ready for 18-inch wafer and new process migration: Q&A with president of microelectronic technologies James Fahey |
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10 Jun 2008: | Own brand strategy: Q&A with TPV Group vice president CH Tuan |
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| Dr. Chii-Ming Yiin, Taiwan's Minister of Economic Affairs |
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| Daily silicon: Q&A with Gary Homan, VP of Hemlock Semiconductor |
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9 Jun 2008: | Trends in storage, the economy and network: Comments from LSI CEO Abhi Talwalkar |
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| Trends in the Wi-Fi industry: An interview with Michael Hurlson of Broadcom |
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6 Jun 2008: | Intel is ready for MID challenge: Q&A with Anand Chandrasekher, manager of Intel ultra mobility group |
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| Ubiquitous media connectivity: A discussion with Alice Chang, CEO of CyberLink |
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5 Jun 2008: | WiMAX is an opportunity for Taiwan to become leading total solutions provider: Interview with John Hsuan, vice chairman of UMC |
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30 May 2008: | Profitability more important than ranking: Q&A with UTAC president and CEO JC Lee |
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21 May 2008: | A focused CMOS image sensor maker: Q&A with OmniVision sales VP Ray Cisneros |
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20 May 2008: | Distributing NXP ICs is "easy": Q&A with NXP Asia Pacific sales and marketing VP TL Chow |
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16 May 2008: | Well-positioned for an audio IC boom: Q&A with Wolfson CEO Dave Shrigley |
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14 May 2008: | Pursuit of a 100% on-year sales growth in 2008: Q&A with PTMD general manager Tom Lei |
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12 May 2008: | From ASIC to CSSP: Q&A with QuickLogic Greater China sales director David Kuo |
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29 Apr 2008: | Pegatron needs more time: Q&A with Denese Yao, spokesperson for Pegatron and Unihan |
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24 Apr 2008: | Taiwan WiMAX deal with Intel a new beginning: Q&A with Ho Mei-yueh, chairperson of CEPD |
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| A "Renaissance" in IC testing and packaging: Q&A with ASE R&D chief officer Ho-Ming Tong |
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23 Apr 2008: | Fair business environment necessary: Q&A with Tessera COO Mike Bereziuk |
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17 Apr 2008: | Hello Mr Chips: Q&A with former Korean Minister of Information amd Communication, Chin Dae-je |
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3 Apr 2008: | MEMS microphone is a business of dedication and diversification: Q&A with Akustica sales VP Michael E Elchik |
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28 Mar 2008: | Pursuit of market share and sales growth to be consistent: Q&A with Freescale sales and marketing senior VP Henri Richard |
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27 Mar 2008: | Handset demand growth in China promising: Q&A with NXP Greater China VP Stephen Lin |
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21 Mar 2008: | MEMS market growth to beat expectations: Q&A with TSMC mainstream technology business development director George Liu |
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18 Mar 2008: | The prospects for medium-size-panels: Q&A with HannStar Display president David Joe |
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| Merger as key to growth: Q&A with GM of analog IC design house GMT |
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14 Mar 2008: | Silicon Laboratories expects strong growth in MCU business this year: Q&A with VP Derrell Coker |
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13 Mar 2008: | Snowstorms spur communications infrastructure demand in China: Q&A with Frank Liang, general manager of Greater China at Broadcom |
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12 Mar 2008: | China domestic demand still strong: Q&A with NXP regional executive for Greater China, Mike Yeh |
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11 Mar 2008: | Capacity expansion not the sole criteria to judge competitiveness: Q&A with Green Energy president Hurlon Lin, part II |
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26 Feb 2008: | Enhanced user experience at core of handset solution: Q&A with TI senior VP of wireless terminals business unit, Greg Delagi |
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22 Feb 2008: | Configurability, differentiation and margin: Q&A with ARC CEO Carl Schlachte |
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15 Feb 2008: | Nvidia talks smartphone plans: Q&A with Michael Rayfield, general manager, mobile business unit |
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13 Feb 2008: | TPO Displays aiming for record performance in 2008: Q&A with company CEO William Chang |
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24 Jan 2008: | More functions not resolution key to advancing digital cameras: Q&A with Casio's "digital camera father" |
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15 Jan 2008: | Providing a start-up platform for equipment localization: Q&A with Applied Materials |
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10 Jan 2008: | Persistent technology advancement to enable growth to beat industry average: Q&A with KLA-Tencor Taiwan GM |
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7 Jan 2008: | NXP-GloNav consolidation synergy to materialize as new solution to launch soon: Q&A with NXP EVP of mobile and personal business unit |
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25 Dec 2007: | Braving the storm in the NAND flash market: Q&A with 3S general manager Hu Ting-chung |
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12 Dec 2007: | Eyeing the China market: Q&A with David Sheu, chairman of equipment supplier Spirox |
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11 Dec 2007: | Penetrating the Japan network-equipment market: Q&A with Toru Okubo, managing director of D-Link Japan |
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5 Dec 2007: | Gearing up for PV industry: Q&A with Applied Materials SVP Mark Pinto |
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4 Dec 2007: | Freeing your phone: Q&A with Sean Moss-Pultz, president of OpenMoko, Part I |
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27 Nov 2007: | LED refrigeration lighting: Q&A with Ledtech chairman Frank Liu |
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26 Nov 2007: | Solar energy business an imperative: Q&A with CMO president Jau-Yang Ho |
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23 Nov 2007: | Treating every customer like Intel: Q&A with Tower CEO Russell Ellwanger |
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22 Nov 2007: | Talking LCD TVs: Q&A with ViewSonic America president Matt Milne |
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20 Nov 2007: | The Eee PC is an extra profit line: Q&A with Jonney Shih and Jonathan Tseng, CEO and president of Asustek |
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| Aiming high: Q&A with Mike Yeh, NXP regional executive for Greater China |
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15 Nov 2007: | No conflict in handset chip market share and profitability: Q&A with STMicroelectronics COO Alain Dutheil |
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8 Nov 2007: | Differentiation the fundamental profit driver: Q&A with Rambus CEO Harold Hughes |
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23 Oct 2007: | Advent of pocket devices means opportunities for everyone: Q&A with Qualcomm UMTS product manager Mohit Bhushan |
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17 Oct 2007: | Acquisition of FCI bearing fruit: An interview with Silicon Motion president Wallace Kou |
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8 Oct 2007: | Brisk IC substrate and PCB sales to resume to normality in 2008: Q&A with Unimicron chairman Tze-Chang Tzeng |
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4 Oct 2007: | HP performing strongly in global notebook market: Q&A with Dan Forlenza, HP's vice president of business notebook unit |
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| Stronger analog deployment, stronger foundries ties: Q&A with MIPS marketing VP Jack Browne |
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1 Oct 2007: | Customer is the key for success: Q&A with TI Asia operation president Larry Tan |
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| ASML reiterates direction on EUV: Q&A with KW Cheng, strategic sales and marketing VP of Asia Pacific |
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14 Sep 2007: | Use of ALD inevitable: Q&A with Aviza Technology president and CEO Jerry Cutini |
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| Living in a material world: Q&A with IC material distributor Wahlee deputy CEO Chun-Yin Chen |
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| Looking beyond driver IC packaging and testing: Q&A with IST president Gray Huang |
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13 Sep 2007: | Bonding with SUSS MicroTec: Q&A with Heinz Siegert, general manager of SUSS Taiwan |
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| Getting to know Terry Tsao: Q&A with the new SEMI Southeast Asia president |
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12 Sep 2007: | The state of the industry: Q&A with SEMI president Stanley Myers |
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11 Sep 2007: | The new direction for AUO: Q&A with AUO chairman, new CEO and president |
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| What is next for Broadcom? 10-15% handset baseband market share by 2009: Q&A with Broadcom CEO Scott A McGregor, Part II |
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10 Sep 2007: | Mobile TV market to enter robust growth starting in 2010: An interview with Sangwoo Han, CTO of FCI |
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7 Sep 2007: | Developing a brand monitor business: Q&A with CH Tuan, VP of TPV |
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6 Sep 2007: | Second 12-inch fab and 32nm migration in the works: Q&A with Chartered CTO Simon Yang |
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3 Sep 2007: | What is next for Broadcom? 10-15% handset baseband market share by 2009: Q&A with Broadcom CEO Scott A McGregor, Part I |
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30 Aug 2007: | Transitioning from a "wafer-printing fab": Q&A with Silterra CEO Eg Kah Yee, part II |
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28 Aug 2007: | Added value key for R&D development: Q&A with Ulf Schneider, Infineon Asia Pacific Singapore development center VP |
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24 Aug 2007: | The niche and big niche for SSD: Q&A with Dean A Klein, Micron memory system development VP, part II |
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15 Aug 2007: | Turning weeks into days: Q&A with Berkeley Design Automation CEO Ravi Subramanian |
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9 Aug 2007: | Taking root in Taiwan: Q&A with Asahi Glass Taiwan subsidiary chairman Tetsuji Kakimoto |
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8 Aug 2007: | Surviving in competitive markets: Q&A with Tony Wong, president of PC Partner |
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| Platform advancement in high gear: Q&A with Novellus dielectric group senior director product manager Julian Hsieh |
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30 Jul 2007: | A perfect spin-off: Q&A with NXP president and CEO Frans van Houten, part II |
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12 Jul 2007: | Controlling your future: Q&A with Arthur Lin, CEO of the Sunix Group |
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28 Jun 2007: | GPS applications in handsets to see explosive growth: Q&A with SiRF founder Kanwar Chadha |
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| Late but focused: Q&A with Kingston NAND flash director, Darwin Chen, part II |
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27 Jun 2007: | MediaFLO ecosystem is ready: Q&A with Omar Javaid from Qualcomm |
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25 Jun 2007: | No more Frankenstein means opportunity: Q&A with Synopsys CEO, Aart de Geus |
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20 Jun 2007: | Blue-laser to take up 20-30% of ODD sales volume in 2010, Q&A with Masayuki Kozuka of Matsushita |
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13 Jun 2007: | When dual-core is a must for handsets: Q&A with Casey Springer from IDT |
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12 Jun 2007: | Asia becoming market leader in Wi-Fi handsets: Q&A with Milos Djokovic, CEO and president of Zi Corporation |
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8 Jun 2007: | Intel discusses quad-core processor server market: Q&A with Boyd Davis, general manager of server platform group marketing of Intel |
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| Intel discusses Bearlake: Q&A with Richard Malinowski, vice president, chipset group, Intel |
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7 Jun 2007: | Computex 2007: Apacer showcasing "True" SATA SSD |
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| Micron 2Gbit DDR3 ready to go, but demand not there |
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6 Jun 2007: | Transcend to expand capacity in China by 50% this year |
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| Vertical integration key to Kingmax success on microSD platform |
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4 Jun 2007: | There is no principle to indicate whether acquisition or separation is good or bad: Q&A with TH Tung, vice chairman of Asustek Computer |
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30 May 2007: | The mobile TV ecosystem: Q&A with Hamutal Raab and Ronen Jashek of mobile chip designer Siano |
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25 May 2007: | Bigger and stronger with Intel: Q&A with Bob Krysiak, VP of STMicroelectronics |
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18 May 2007: | Let customer transitions, not technology, drive your roadmaps: Q&A with Patrick Patla, director, server/workstation division of AMD (part 2) |
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14 May 2007: | Gintech: We are 100% sufficient in polysilicon for 2007, part two |
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10 May 2007: | Riding the next crystal wave: Q&A with AUO president HB Chen |
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4 May 2007: | Gintech: We are 100% sufficient in polysilicon for 2007 |
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1 May 2007: | From acorns to mighty oaks: Q&A with ARM COO Tudor Brown, part two |
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24 Apr 2007: | From acorns to mighty oaks: Q&A with ARM COO Tudor Brown, part one |
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20 Apr 2007: | Moore's Law and FPGAs: Q&A with Xilinx CEO Wim Roelandts |
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19 Apr 2007: | Pioneer to promote blue-laser ODDs by offering BD Combo instead of BD/HD DVD Dual |
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16 Apr 2007: | Intel and low-cost PCs in emerging markets: Q&A with John Antone, general manager of Intel Asia-Pacific |
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14 Apr 2007: | UniVox untethers the VoIP user: Q&A with CSR's Eric Janson, part one |
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5 Apr 2007: | Optical circuits and virtualization: Q&A with George Ng, Sun Microsystems' sales director for Greater China |
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12 Mar 2007: | The coming of all-IP networks and business opportunities: Q&A with Mats H Olsson, president, Ericsson Greater China |
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1 Mar 2007: | AMD keeping open platform strategy: Q&A with sales and marketing vice president Jochen Polster |
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