Processes below 40nm account for 27% of global wafer capacity, says IC Insights

Jessie Shen, DIGITIMES, Taipei Tuesday 9 April 2013 0

More than 25% of installed wafer capacity worldwide was dedicated to the production of ICs having geometries smaller than 40nm as of the end of 2012, while about 22% of the global capacity was for mature process nodes at 90nm, and 0.13- and 0.18-micron,...

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