Bits + chips
TSMC and OIP ecosystem partners deliver 16FinFET and 3D IC reference flows
Press release; Steve Shen, DIGITIMES

Taiwan Semiconductor Manufacturing Company (TSMC) has released three silicon-validated reference flows within the Open Innovation Platform (OIP) that enable 16FinFET system-on-chip (SoC) designs and 3D chip stacking packages. Leading electronic design...

The article you are trying to open requires News database subscription. Please sign in if you wish to continue.
Realtime news
© 2020 DIGITIMES Inc. All rights reserved.
Please do not republish, publicly broadcast or publicly transmit content from this website without written permission from DIGITIMES Inc. Please contact us if you have any questions.